Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 194
Datasheet Volume One
Package Mechanical Specifications
9 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA12)package that
interfaces with the baseboard via an 1356-2 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 9-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the
Intel® Xeon® Processor E5-2400 v2 Product Family Thermal/Mechanical Design
Guide (TMDG) for complete details on the 1356 socket.
The package components shown in Figure 9-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and baseboard are included for reference and are not part of the processor package.
9.1 Package Mechanical Drawing
The package mechanical drawing is shown in Figure 9-2. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions
include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
Figure 9-1. Processor Package Assembly Sketch
Die