Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 200
Datasheet Volume One
Boxed Processor Specifications
10 Boxed Processor Specifications
10.1 Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Intel® Xeon® processor E5-
2400 v2 product family (LGA1356) processors will be offered as Intel boxed processors,
however the thermal solutions will be sold separately.
Boxed processors will not include a thermal solution in the box. Intel will offer boxed
thermal solutions separately through the same distribution channels. Please reference
Section 10.1.1 - Section 10.1.4 for a description of Boxed Processor thermal solutions.
10.1.1 Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support LGA1356 Boxed
Processors
• Boxed Intel® Thermal Solution STS100C (Order Code BXSTS100C): A Passive /
Active Combination Heat Sink Solution that is intended for Intel® Xeon® processor
E5-2400 v2 product family processors with a TDP up to 95W in a pedestal or 2U+
chassis with appropriate ducting.
•Boxed Intel

Thermal Solution STS100A (Order Code BXSTS100A): An Active Heat
Sink Solution that is intended for Intel® Xeon® processor E5-2400 v2 product
family processors with a TDP of 95W or lower in pedestal chassis.
• Boxed Intel® Thermal Solution STS100P (Order Code BXSTS100P): A 25.5 mm
Tall Passive Heat Sink Solution that is intended for processors with a TDP of 95W or
lower in 1U, or 2U chassis with appropriate ducting. Check with Blade manufacturer
for compatibility.
10.1.2 Intel Thermal Solution STS100C
(Passive/Active Combination Heat Sink Solution)
The STS100C, based on a 2U passive heat sink with a removable fan, is intended for
use with Intel® Xeon® processor E5-2400 v2 product family processors with TDP’s up
to 95W. This heat pipe-based solution is intended to be used as either a passive heat
sink in a 2U or larger chassis, or as an active heat sink for pedestal chassis and will
provide improved acoustic performance when compared to the STS100A. Figure 10-1
and Figure 10-2 are representations of the heat sink solution. Although the active
combination solution with the removable fan installed mechanically fits into a 2U
keepout, its use has not been validated in that configuration.
The STS100C in the active fan configuration is primarily designed to be used in a
pedestal chassis where sufficient air inlet space is present. The STS100C with the fan
removed, as with any passive thermal solution, will require the use of chassis ducting
and are targeted for use in rack mount or ducted pedestal servers. The retention
solution used for these products is called Unified Retention System (URS).