Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 201
Datasheet Volume One
Boxed Processor Specifications
10.1.3 Intel Thermal Solution STS100A (Active Heat Sink
Solution)
The STS100A in the active fan configuration is primarily designed to be used in a
pedestal chassis where sufficient air inlet space is present (see Figure 10-3). The
STS100A with the fan removed, as with any passive thermal solution, will require the
use of chassis ducting and is targeted for use in rack mount or ducted pedestal servers.
The retention solution used for these products is called Unified Retention System
(URS).
The STS100C and STS100A utilize a fan capable of 4-pin pulse width modulated (PWM)
control. Use of a 4-pin PWM controlled active thermal solution helps customers meet
acoustic targets in pedestal platforms through the baseboard’s ability to directly control
the RPM of the processor heat sink fan. See Section 10.3 for more details on fan speed
control. Also see Section 2.5, “Platform Environment Control Interface (PECI)" for more
Figure 10-1. STS100C Passive/Active Combination Heat Sink (with Removable Fan)
Figure 10-2. STS100C Passive/Active Combination Heat Sink (with Fan Removed)