Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 202
Datasheet Volume One
Boxed Processor Specifications
on the PWM and PECI interface along with Digital Thermal Sensors (DTS).
10.1.4 Intel Thermal Solution STS100P
(Boxed 25.5 mm Tall Passive Heat Sink Solution)
The STS100Pis available for use with boxed processors that have TDP’s of 95W and
lower. The 25.5 mm Tall passive solution is designed to be used in SSI Blades, 1U, and
2U chassis where ducting is present. The use of a 25.5 mm Tall heatsink in a 2U chassis
is recommended to achieve a lower heatsink T
LA
and more flexibility in system design
optimization. Figure 10-4 is a representation of the heat sink solution. The retention
solution used for these products is called Unified Retention System (URS).
Figure 10-3. STS100A Active Heat Sink
Figure 10-4. STS100P 25.5 mm Tall Passive Heat Sink