Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 21
Datasheet Volume One
Overview
Intel® TXT Intel® Trusted Execution Technology
Intel® Virtualization
Technology (Intel® VT)
Processor virtualization which when used in conjunction with Virtual Machine
Monitor software enables multiple, robust independent software environments
inside a single platform.
Intel® VT-d Intel® Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a
hardware assist, under system software (Virtual Machine Manager or OS)
control, for enabling I/O device virtualization. Intel VT-d also brings robust
security by providing protection from errant DMAs by using DMA remapping, a
key feature of Intel VT-d.
Intel® Xeon® processor
E5-2400 v2 product family
Intel 22-nm processor design, follow-on to the 32-nm design Intel® Xeon®
processor E5-2400 product family.
Integrated Heat Spreader
(IHS)
A component of the processor package used to enhance the thermal
performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Jitter Any timing variation of a transition edge or edges from the defined Unit Interval
(UI).
IOV I/O Virtualization
LGA1356 Socket The 1356-land FCLGA package mates with the system board through this surface
mount, 1356-contact socket.
LLC Last Level Cache
LRDIMM Load Reduced Dual In-line Memory Module
NCTF Non-Critical to Function: NCTF locations are typically redundant ground or non-
critical reserved, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.
NEBS Network Equipment Building System. NEBS is the most common set of
environmental design guidelines applied to telecommunications equipment in the
United States.
PCH Platform Controller Hub. The next generation chipset with centralized platform
capabilities including the main I/O interfaces along with display connectivity,
audio features, power management, manageability, security and storage
features.
PCU Power Control Unit
PCI Express* 3.0 PCI Express* Generation 3.0
The third generation PCI Express* specification that operates at twice the speed
of PCI Express* 2.0 (8 Gb/s). PCI Express* 3.0 is backward compatible with PCI
Express* 1.0 and 2.0.
PCI Express* 2.0 PCI Express* Generation 2.0
PCI Express* PCI Express* Generation 2.0/3.0
PECI Platform Environment Control Interface
Phit
Physical Unit. An Intel® QPI terminology defining units of transfer at the physical
layer. 1 Phit is equal to 20 bits in ‘full width mode’ and 10 bits in ‘half width
mode’
Processor The 64-bit, single-core or multi-core component (package)
Processor Core The term “processor core” refers to silicon die itself which can contain multiple
execution cores. Each execution core has an instruction cache, data cache, and
256-KB L2 cache. All execution cores share the L3 cache. All DC and AC timing
and signal integrity specifications are measured at the processor die (pads),
unless otherwise noted.
Protected Processor
Inventory Number (PPIN)
A solution for inventory management available on Intel Xeon processor E5
product families for use in server platforms. PPIN defaults to disabled and follows
an 'opt-in' model to enable it. Once PPIN is enabled, a reboot is necessary to
make it available to privileged software, such as the OS or VMM and other ring 0
applications.
RDIMM Registered Dual In-line Module
Term Description