Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 212
Datasheet Volume One
Boxed Processor Specifications
10.2.2 Boxed Processor Retention Mechanism and Heat Sink
Support (URS)
Baseboards designed for use by a system integrator should include holes that are in
proper alignment with each other to support the boxed processor. Refer to Figure 10-5
through Figure 10-8 for LGA1356 mounting hole dimensions.
LGA1356 Unified Retention System (URS) and the Unified Backplate Assembly. The URS
is designed to extend air-cooling capability through the use of larger heat sinks with
minimal airflow blockage and bypass. URS retention transfers load to the baseboard via
the Unified Backplate Assembly. The URS spring, captive in the heatsink, provides the
necessary compressive load for the thermal interface material. For specific design
details on the URS and the Unified Backplate please refer to the
Intel® Xeon®
Processor E5-2400 v2 Product Family Thermal/Mechanical Design Guide (TMDG)
.
All components of the URS heat sink solution will be captive to the heat sink and will
only require a Phillips screwdriver to attach to the Unified Backplate Assembly. When
installing the URS the screws should be tightened until they will no longer turn easily.
This should represent approximately 8 inch-pounds of torque. More than that may
damage the retention mechanism components.
10.3 Fan Power Supply [STS100C and STS100A]
The 4-pin PWM controlled thermal solution is being offered to help provide better
control over pedestal chassis acoustics. This is achieved through more accurate
measurement of processor die temperature through the processor’s Digital Thermal
Sensors. Fan RPM is modulated through the use of an ASIC located on the baseboard
that sends out a PWM control signal to the 4th pin of the connector labeled as Control.
This thermal solution requires a constant +12 V supplied to pin 2 of the active thermal
solution and does not support variable voltage control or 3-pin PWM control. See
Figure 10-13 and Table 10-1 for details on the 4-pin active heat sink solution
connectors.
The fan power header on the baseboard must be positioned to allow the fan heat sink
power cable to reach it. The fan power header identification and location must be
documented in the suppliers platform documentation, or on the baseboard itself. The
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the
center of the processor socket.
Table 10-1. PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution
Description Min Frequency Nominal Frequency Max Frequency Unit
PWM Control Frequency
Range
21,000 25,000 28,000 Hz
Table 10-2. PWM Fan Characteristics for Active Thermal Solution
Description Min Typical
Max
Steady
Max
Startup
Unit
+12V: 12-Volt Supply 10.8 12 12 13.2 V
IC: Fan Current Draw N/A 1.25 1.5 2.2 A
Sense Pulse Frequency 2
Pulses per fan
revolution