Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 214
Datasheet Volume One
Boxed Processor Specifications
In the passive configuration it is assumed that a chassis duct will be implemented.
For a list processor and thermal solution boundary conditions, such as Psi
ca
, T
LA
,
airflow, flow impedance, etc, Table 10-4. It is recommended that the ambient air
temperature outside of the chassis be kept at or below 35
°C. Meeting the processor’s
temperature specification is the responsibility of the system integrator.
This thermal solution is for use with processor SKUs no higher than 95W (8 and 10
Core), 80W (4 and 6 Core).
10.3.1.3 STS100P (25.5mm Passive Heat Sink) (Blade + 1U + 2U Rack)
This passive solution is intended for use in SSI Blade, 1U or 2U rack configurations. It
is assumed that a chassis duct will be implemented in all configurations.
For a list processor and thermal solution boundary conditions, such as Psi
ca
, T
LA
,
airflow, flow impedance, etc, see Table 10-4. It is recommended that the ambient air
temperature outside of the chassis be kept at or below 35
°C. Meeting the processor’s
temperature specification is the responsibility of the system integrator.
Note: This thermal solution is for use with processor SKUs no higher than 95W (8 and 10
Core), 80W (4 and 6 Core). Please refer to the
Intel® Xeon® Processor E5-2400 v2
Product Family Thermal/Mechanical Design Guide (TMDG)
for detailed mechanical
drawings of the STS100P.
Table 10-4. Processor Thermal Solution Boundary Conditions
Form
Factor
Thermal
Solution
Heatsink
Volumetric
4
(mm)
Airflow
3
(CFM)
(inch of
H
2
O)
Delta P TDP (W)
Core
Count
Ψ
CA
2
(˚C/W)
T
LA
1
(˚C)
1U STS100P 90 x 90 x 25.5 9.7 0.196
95 10 0.316 50.0
95 8 0.320 49.6
80 6 / 4 0.333 49.4
60 10 0.313 49.2
60 6 0.334 49.0
2U
STS100A
(without fan)
90 x 90 x 64 26
0.070
95 10 0.311 50.5
95 8 0.315 50.1
80 6 / 4 0.328 49.8
60 10 0.308 49.5
60 6 0.329 49.3
STS100C
(without fan)
0.140
95 10 0.186 62.3
95 8 0.190 62.0
80 6 / 4 0.203 59.8
60 10 0.183 57.0
60 6 0.204 56.8