Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 215
Datasheet Volume One
Boxed Processor Specifications
Notes:
1. Local ambient temperature of the air entering the heatsink or fan. System ambient and altitude are assumed 35C and sea
level.
2. Max target (mean + 3 sigma) for thermal characterization parameter.
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Dimensions of heatsinks do not include socket or processor.
5. This is a tray product only. Alternate thermal profiles are available with higher T
LA
, see specific processor specifications for
details.
Pedestal
STS100A
(with fan)
90 x 90 x 64
Max
RPM
N/A
95 10 0.281 53.3
95 8 0.285 52.9
80 6 / 4 0.298 52.2
60 10 0.278 51.3
60 6 0.299 51.1
STS100C
(with fan)
95 10 0.180 62.9
95 8 0.184 62.5
80 6 / 4 0.197 60.2
60 10 0.177 57.4
60 6 0.198 57.1
Table 10-4. Processor Thermal Solution Boundary Conditions
Form
Factor
Thermal
Solution
Heatsink
Volumetric
4
(mm)
Airflow
3
(CFM)
(inch of
H
2
O)
Delta P TDP (W)
Core
Count
Ψ
CA
2
(˚C/W)
T
LA
1
(˚C)