Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 3
Datasheet Volume One
Table of Contents
1Overview.................................................................................................................13
1.1 Introduction ..................................................................................................... 13
1.1.1 Processor Feature Details ........................................................................14
1.1.2 Supported Technologies ..........................................................................14
1.2 Interfaces ........................................................................................................15
1.2.1 System Memory Support.........................................................................15
1.2.2 PCI Express* ......................................................................................... 16
1.2.3 Direct Media Interface Gen 2 (DMI2).........................................................17
1.2.4 Intel® QuickPath Interconnect (Intel® QPI) ..............................................18
1.2.5 Platform Environment Control Interface (PECI)...........................................18
1.3 Power Management Support ............................................................................... 19
1.3.1 Processor Package and Core States........................................................... 19
1.3.2 System States Support ...........................................................................19
1.3.3 Memory Controller..................................................................................19
1.3.4 PCI Express* ......................................................................................... 19
1.3.5 Intel® QPI ............................................................................................19
1.4 Thermal Management Support ............................................................................19
1.5 Package Summary.............................................................................................20
1.6 Terminology ....................................................................................................20
1.7 Related Documents ...........................................................................................22
1.8 Statement of Volatility (SOV)..............................................................................23
1.9 State of Data....................................................................................................23
2Interfaces................................................................................................................24
2.1 System Memory Interface ..................................................................................24
2.1.1 System Memory Technology Support ........................................................24
2.1.2 System Memory Timing Support...............................................................24
2.2 PCI Express* Interface.......................................................................................25
2.2.1 PCI Express* Architecture .......................................................................25
2.2.1.1 Transaction Layer ..................................................................... 26
2.2.1.2 Data Link Layer ........................................................................ 26
2.2.1.3 Physical Layer ..........................................................................26
2.2.2 PCI Express* Configuration Mechanism .....................................................27
2.3 DMI2/PCI Express* Interface..............................................................................27
2.3.1 DMI2 Error Flow..................................................................................... 27
2.3.2 Processor/PCH Compatibility Assumptions.................................................. 27
2.3.3 DMI2 Link Down.....................................................................................27
2.4 Intel® QuickPath Interconnect (Intel® QPI) .........................................................28
2.5 Platform Environment Control Interface (PECI)......................................................29
2.5.1 PECI Client Capabilities ...........................................................................29
2.5.1.1 Thermal Management................................................................ 30
2.5.1.2 Platform Manageability ..............................................................30
2.5.2 Client Command Suite ............................................................................30
2.5.2.1 Ping()......................................................................................30
2.5.2.2 GetDIB() ................................................................................. 31
2.5.2.3 GetTemp()...............................................................................33
2.5.2.4 RdPkgConfig()..........................................................................34
2.5.2.5 WrPkgConfig()..........................................................................35
2.5.2.6 Package Configuration Capabilities ..............................................37
2.5.2.7 RdIAMSR()...............................................................................59
2.5.2.8 RdPCIConfig() ..........................................................................63
2.5.2.9 RdPCIConfigLocal() ...................................................................64
2.5.2.10 WrPCIConfigLocal()................................................................... 66
2.5.3 Client Management.................................................................................68