Datasheet
Intel® Xeon® Processor E5-2400 v2 Product Family 6
Datasheet Volume One
7.1 Processor Signaling ......................................................................................... 124
7.1.1 System Memory Interface Signal Groups ................................................. 124
7.1.2 PCI Express* Signals ............................................................................ 124
7.1.3 DMI2/PCI Express* Signals.................................................................... 124
7.1.4 Intel® QuickPath Interconnect (Intel® QPI) ............................................ 124
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 125
7.1.5.1 Input Device Hysteresis........................................................... 125
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 125
7.1.6.1 PLL Power Supply ................................................................... 126
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 126
7.1.8 Processor Sideband Signals ................................................................... 126
7.1.9 Power, Ground and Sense Signals........................................................... 126
7.1.9.1 Power and Ground Lands ......................................................... 126
7.1.9.2 Decoupling Guidelines ............................................................. 127
7.1.9.3 Voltage Identification (VID)...................................................... 127
7.1.10 Reserved or Unused Signals................................................................... 131
7.2 Signal Group Summary.................................................................................... 132
7.3 Power-On Configuration (POC) Options............................................................... 135
7.4 Fault Resilient Booting (FRB)............................................................................. 136
7.5 Mixing Processors............................................................................................ 136
7.6 Flexible Motherboard Guidelines (FMB)............................................................... 137
7.7 Absolute Maximum and Minimum Ratings ........................................................... 137
7.7.1 Storage Condition Specifications............................................................. 138
7.8 DC Specifications ............................................................................................ 138
7.8.1 Voltage and Current Specifications.......................................................... 139
7.8.2 Die Voltage Validation........................................................................... 143
7.8.2.1 VCC Overshoot Specifications ................................................... 143
7.8.3 Signal DC Specifications........................................................................ 144
7.8.3.1 PCI Express* DC Specifications................................................. 149
7.8.3.2 DMI2/PCI Express* DC Specifications ........................................ 149
7.8.3.3 Intel® QuickPath Interconnect DC Specifications......................... 149
7.8.3.4 Reset and Miscellaneous Signal DC Specifications........................ 149
7.8.3.5 PCI Express* AC Specifications................................................. 149
7.8.3.6 DMI2/PCI Express* AC Specifications ........................................ 150
7.8.3.7 Intel® QuickPath Interconnect AC Specifications......................... 150
7.8.3.8 SMBus Signal AC Specifications................................................. 150
7.8.3.9 Reset and Miscellaneous Signal AC Specifications ........................ 150
7.9 Signal Quality................................................................................................. 152
7.9.1 DDR3 Signal Quality Specifications ......................................................... 153
7.9.2 I/O Signal Quality Specifications............................................................. 153
7.9.3 Intel® QuickPath Interconnect Signal Quality Specifications....................... 153
7.9.4 Input Reference Clock Signal Quality Specifications................................... 153
7.9.5 Overshoot/Undershoot Tolerance............................................................ 153
7.9.5.1 Overshoot/Undershoot Magnitude ............................................. 154
7.9.5.2 Overshoot/Undershoot Pulse Duration ....................................... 154
7.9.5.3 Activity Factor........................................................................ 154
7.9.5.4 Reading Overshoot/Undershoot Specification Tables .................... 155
7.9.5.5 Compliance to Overshoot/Undershoot Specifications .................... 155
8 Processor Land Listing........................................................................................... 157
8.1 Listing by Land Name ...................................................................................... 157
8.2 Listing by Land Number ................................................................................... 175
9 Package Mechanical Specifications ........................................................................ 194
9.1 Package Mechanical Drawing............................................................................. 194
9.2 Processor Component Keep-Out Zones............................................................... 198
9.3 Package Loading Specifications ......................................................................... 198
9.4 Package Handling Guidelines............................................................................. 198