Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 7
Datasheet Volume One
9.5 Package Insertion Specifications........................................................................ 198
9.6 Processor Mass Specification............................................................................. 199
9.7 Processor Materials.......................................................................................... 199
9.8 Processor Markings.......................................................................................... 199
10 Boxed Processor Specifications ............................................................................. 200
10.1 Introduction ................................................................................................... 200
10.1.1 Available Boxed Thermal Solution Configurations...................................... 200
10.1.2 Intel Thermal Solution STS100C
(Passive/Active Combination Heat Sink Solution)...................................... 200
10.1.3 Intel Thermal Solution STS100A (Active Heat Sink Solution) ...................... 201
10.1.4 Intel Thermal Solution STS100P
(Boxed 25.5 mm Tall Passive Heat Sink Solution) ..................................... 202
10.2 Mechanical Specifications ................................................................................. 203
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones........ 203
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS) .......... 212
10.3 Fan Power Supply [STS100C and STS100A]........................................................ 212
10.3.1 Boxed Processor Cooling Requirements ................................................... 213
10.3.1.1 STS100C(Passive / Active Combination Heat Sink Solution).......... 213
10.3.1.2 STS100A (Active Heat Sink Solution) (Pedestal only)................... 213
10.3.1.3 STS100P (25.5mm Passive Heat Sink) (Blade + 1U + 2U Rack) .... 214
10.4 Boxed Processor Contents ................................................................................ 216
Figures
1-1 Processor Two-Socket Platform ...........................................................................14
1-2 PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) .................. 17
2-1 PCI Express* Layering Diagram...........................................................................25
2-2 Packet Flow through the Layers...........................................................................26
2-3 Ping().............................................................................................................. 31
2-4 Ping() Example .................................................................................................31
2-5 GetDIB()..........................................................................................................31
2-6 Device Info Field Definition.................................................................................32
2-7 Revision Number Definition.................................................................................32
2-8 GetTemp() .......................................................................................................33
2-9 GetTemp() Example...........................................................................................34
2-10 RdPkgConfig() .................................................................................................. 35
2-11 WrPkgConfig() ..................................................................................................36
2-12 DRAM Thermal Estimation Configuration Data .......................................................39
2-13 DRAM Rank Temperature Write Data....................................................................40
2-14 DIMM Temperature Read / Write .........................................................................41
2-15 Ambient Temperature Reference Data..................................................................41
2-16 DRAM Channel Temperature ...............................................................................42
2-17 Accumulated DRAM Energy Data ......................................................................... 42
2-18 DRAM Power Info Read Data............................................................................... 43
2-19 DRAM Power Limit Data......................................................................................44
2-20 DRAM Power Limit Performance Data...................................................................45
2-21 CPUID Data......................................................................................................48
2-22 Platform ID Data...............................................................................................49
2-23 PCU Device ID ..................................................................................................49
2-24 Maximum Thread ID .......................................................................................... 49
2-25 Processor Microcode Revision..............................................................................49
2-26 Machine Check Status........................................................................................50
2-27 Package Power SKU Unit Data.............................................................................50
2-28 Package Power SKU Data ...................................................................................51