Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 9
Datasheet Volume One
10-5 Boxed Processor Motherboard Keepout Zones (1 of 4).......................................... 204
10-6 Boxed Processor Motherboard Keepout Zones (2 of 4).......................................... 205
10-7 Boxed Processor Motherboard Keepout Zones (3 of 4).......................................... 206
10-8 Boxed Processor Motherboard Keepout Zones (4 of 4).......................................... 207
10-9 Boxed Processor Heat Sink Volumetric (1 of 2).................................................... 208
10-10 Boxed Processor Heat Sink Volumetric (2 of 2).................................................... 209
10-11 4-Pin Fan Cable Connector (For Active Heat Sink)................................................ 210
10-12 4-Pin Base Baseboard Fan Header (For Active Heat Sink)...................................... 211
10-13 Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution ............................. 213
Tables
1-1 Code Name to Product Family Name ....................................................................13
1-2 Volume Structure and Scope...............................................................................13
1-3 Related Documents and Specifications..................................................................22
2-1 Summary of Processor-specific PECI Commands....................................................29
2-2 Minor Revision Number Meaning..........................................................................32
2-3 GetTemp() Response Definition...........................................................................34
2-4 RdPkgConfig() Response Definition ...................................................................... 35
2-5 WrPkgConfig() Response Definition...................................................................... 37
2-6 RdPkgConfig() & WrPkgConfig() DRAM Thermal and Power Optimization
Services Summary ............................................................................................38
2-7 Channel & DIMM Index Decoding.........................................................................40
2-8 RdPkgConfig() & WrPkgConfig() CPU Thermal and Power Optimization
Services Summary ............................................................................................45
2-9 Power Control Register Unit Calculations...............................................................50
2-10 RdIAMSR() Response Definition...........................................................................61
2-11 RdIAMSR() Services Summary............................................................................ 62
2-12 RdPCIConfig() Response Definition ......................................................................64
2-13 RdPCIConfigLocal() Response Definition ...............................................................66
2-14 WrPCIConfigLocal() Response Definition ...............................................................67
2-15 WrPCIConfigLocal() Memory Controller and IIO Device/Function Support ..................68
2-16 PECI Client Response During Power-Up ................................................................69
2-17 SOCKET ID Strapping ........................................................................................70
2-18 Power Impact of PECI Commands vs. C-states ......................................................70
2-19 Domain ID Definition ......................................................................................... 73
2-20 Multi-Domain Command Code Reference .............................................................. 73
2-21 Completion Code Pass/Fail Mask..........................................................................74
2-22 Device Specific Completion Code (CC) Definition....................................................74
2-23 Originator Response Guidelines...........................................................................75
2-24 Error Codes and Descriptions ..............................................................................76
4-1 System States ..................................................................................................85
4-2 Package C-State Support....................................................................................85
4-3 Core C-State Support......................................................................................... 86
4-4 System Memory Power States............................................................................. 86
4-5 DMI2/PCI Express* Link States ...........................................................................87
4-6 Intel® QPI States..............................................................................................87
4-7 G, S and C State Combinations ...........................................................................87
4-8 P_LVLx to MWAIT Conversion..............................................................................90
4-9 Coordination of Core Power States at the Package Level .........................................92
4-10 Package C-State Power Specifications ..................................................................95
4-11 Pmax Specifications Table ..................................................................................95
5-1 Case Temperature Thermal Specifications........................................................... 101