Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 99
Datasheet Volume One
Thermal Management Specifications
The temperature reported over PECI is always a negative value and represents a delta
below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT_N
(see Section 7, “Electrical Specifications”). Systems that implement fan speed control
must be designed to use this data. Systems that do not alter the fan speed need to
guarantee the case temperature meets the thermal profile specifications.
The processor thermal profiles for planned SKUs are summarized in Section 5.1.3.
Thermal profiles ensure adherence to Intel reliability requirements. With adherence to
the thermal profile, it is expected that the Thermal Control Circuit (TCC) would be
activated for very brief periods of time when running the most power intensive
applications. Additionally, utilization of a thermal solution that does not meet this
Thermal Profile will violate the thermal specifications and may result in permanent
damage to the processor. Refer to the
Intel® Xeon® Processor E5-2400 v2 Product
Family Thermal/Mechanical Design Guide (TMDG) for details on system thermal
solution design, thermal profiles and environmental considerations.
For Embedded Servers, Communications and storage markets Intel has plan SKU’s that
support Thermal Profiles with nominal and short-term conditions for products intended
for NEBS level 3 thermal excursions. For these SKU’s operation at either the nominal or
short-term thermal profiles should result in virtually no TCC activation. Thermal Profiles
for these SKU’s are found in Section 5.1.4.
Intel recommends that complete thermal solution designs target the Thermal Design
Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the
processor in the event that an application exceeds the TDP recommendation for a
sustained time period. To ensure maximum flexibility for future requirements, systems
should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor
with lower power dissipation is currently planned. The Adaptive Thermal Monitor
feature must be enabled for the processor to remain within its specifications.