Datasheet

NICHIA STS-DA1-2554A <Cat.No.120709>
13
RELIABILITY
(1) Tests and Results
Test
Reference
Standard
Test Conditions
Test
Duration
Failure
Criteria
#
Units
Failed/Tested
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
T
sld
=260°C, 10sec, 2reflows,
Precondition: 30°C, 70%RH, 168hr
#1 0/22
Solderability
(Reflow Soldering)
JEITA ED-4701
303 303A
T
sld
=245±5°C, 5sec,
Lead-free Solder(Sn-3.0Ag-0.5Cu)
#2 0/22
Temperature Cycle
JEITA ED-4701
100 105
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
100cycles #1 0/50
Moisture Resistance
(Cyclic)
JEITA ED-4701
200 203
25°C~65°C~-10°C, 90%RH,
24hr per cycle
10cycles #1 0/22
High Temperature
Storage
JEITA ED-4701
200 201
T
A
=100°C 1000hours #1 0/22
Temperature Humidity
Storage
JEITA ED-4701
100 103
T
A
=60°C, RH=90% 1000hours #1 0/22
Low Temperature
Storage
JEITA ED-4701
200 202
T
A
=-40°C 1000hours #1 0/22
Room Temperature
Operating Life
Condition 1
T
A
=25°C, I
F
=150mA
Test board: See NOTES below
1000hours #1 0/22
Room Temperature
Operating Life
Condition 2
T
A
=25°C, I
F
=180mA
Test board: See NOTES below
500hours #1 0/22
High Temperature
Operating Life
T
A
=100°C, I
F
=70mA
Test board: See NOTES below
1000hours #1 0/22
Temperature Humidity
Operating Life
60°C, RH=90%, I
F
=150mA
Test board: See NOTES below
500hours #1 0/22
Low Temperature
Operating Life
T
A
=-40°C, I
F
=150mA
Test board: See NOTES below
1000hours #1 0/22
Vibration
JEITA ED-4701
400 403
200m/s
2
, 100~2000~100Hz,
4cycles, 4min, each X, Y, Z
48minutes #1 0/22
Electrostatic Discharges
JEITA ED-4701
300 304
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
alternately positive or negative
#1 0/22
Soldering Joint Shear
Strength
JEITA ED-4702B
002 3
5N, 10±1sec #1 0/22
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, R
θJA
≈82°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria # Items Conditions Failure Criteria
Forward Voltage(V
F
) I
F
=150mA >U.S.L.×1.1
#1
Luminous Flux(Φ
V
) I
F
=150mA <L.S.L.×0.7
#2 Solderability - Less than 95% solder coverage
U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit