Datasheet

NICHIA STS-DA1-2069B <Cat.No.120418>
5
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Soldering Pad Pattern
(単位 Unit: mm)
2.38
4.6
8
3.01
3.9
Cathode
Anode
Die Heat Sink and the cathode should be soldered to a PCB.
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to wire damage or breakage.
(単位 Unit: mm)
2.7
5.3
(6.3)
(4.0)
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Die Heat Sink should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* This LED can be soldered to a PCB designed for the recommended soldering pad pattern of Nichia’s 183series.
120sec Max
Pre-heat
180 to 200°C
260°C Max
10sec Max
60sec Max
Above 220°C
1 to 5°C per sec