User's Manual

36
2016-03-18
NUR-10W HW Implementation Guide v1.4
MSL level and open time
MSL level
5
Open time (floor life out of the
bag)
48h
10.2 SOLDERING PROCESS
Boundary conditions
Acceptable soldering methods
Convection reflow in air or nitrogen atmosphere
Condensation reflow soldering (vapor phase)
Recommended stencil thickness
125um ±10um
Pad design on motherboard
See recommended pad pattern
Stencil openings
See recommended stencil pattern
Recommended solder alloy
SnAg3.8±0.2Cu0.7±0.2
Note! If using under-eutectic solder alloys, such as
SAC305, it may be necessary to increase reflow
peak temperature by 5-10°C, due to higher mp.
and lower fluidity of non-eutectic SnAgCu alloys.
This will increase thermal stress to module and
motherboard greatly.
Convection reflow oven heater
configuration
Double sided heating required in reflow,
recommended in preheating zones.
Maximum absorbed moisture
content prior to thermal
processing
0.1%-w (Test method IPC-TM-650, 2.6.28)
Moisture content and/or moisture absorption
rate, Printed Board
Recommended moisture
reduction condition
+60°C/12h vacuum pack removed during drying,
re-seal after drying, unless modules will be used
within allowed open time after drying
Moisture and solvent
contamination
No moisture or solvent contamination allowed in
solder paste or on solderable surfaces
Recommended reflow conditions
Preheating phase
-max. duration 180s
-end temperature 190-200°C