User Manual

Glossary G-3
PWB: Printed Wiring Board. An insulating
board containing conductive tracks for electrical
circuit connections on which chips and other
electronic components are placed.
Pallet: A device onto which workpieces are
mounted and carried during the dispensing
process.
Pattern: A list of instructions that execute
relative to a local coordinate system based on
the origin point of the pattern. Each product
program has a Main Pattern that executes when
the program runs. Instructions in the Main
Pattern can execute other patterns in the program
one or more times.
Pattern Frame: The origin coordinates of
patterns (other than the Main Pattern) are
expressed as a set of coordinates.
Periodic Procedure: Periodic procedures allow
a sequence of operations to be performed
periodically during production.
Procedure: A list of instructions that execute in
the global (robot home) coordinate system.
Procedures are typically used for maintenance
operations, as they do not contain any product-
specific information.
Product: A circuit board or a pallet holding one
or more circuit boards.
Product Frame: ECXP uses fixture constraint
coordinates, plus the length and width of the
product, to calculate the coordinates of the
Product Frame within the Base Frame. The
Product Frame origin is the calculated Main
Pattern Edit Frame.
Product Program: A program created for a
particular product. It contains a Main Pattern
that is placed by ECXP at the FrontLeft corner
of the board, determined by the program’s
length and width values and the fixture location
and constraint.
Program: A collection of patterns and
procedures.
Reference Frame: All positioning in the
workcell is done with reference to sets of
position coordinates, called Reference Frames.
In ECXP, three different sets of Reference
Frames are used: Base Frame, Product Frame,
and Pattern Frame.
Safe Z Height: This is the height below which
the tool tip cannot go when moving from one set
of coordinates to another during operation.
SC-105HS High Speed Film Coater: Asymtek
5-axis circulating Fluid Applicator, with a 0-
360° rotate mechanism plus tilt, that applies
conformal coating in a film rather than an
atomized spray.
SC-200 Slim Swirl Applicator: Asymtek Fluid
Applicator that uses slim swirl 12-hole nozzles
to apply materials that do not required heating in
a bead, monofilament, or swirl pattern.
SC-204HS High Speed Non-Circulating Film
Coater: Asymtek 4-axis non-circulating Fluid
Applicator, with a 0-90° rotate mechanism, that
applies conformal coating in a film rather than
an atomized spray.
SC-205 Non-Circulating Film Coater:
Asymtek 5-axis non-circulating Fluid
Applicator, with a 0-360° rotate mechanism plus
tilt, that applies conformal coating in a film
rather than an atomized spray.
SC-300 Swirl Coat Applicator: A non-contact
coating applicator providing high-speed delivery
and exceptional volumetric control for various
fluids. Ideal for conformal coating applications,
the SC-300 Swirl Coat applicator offers three
modes of operation: bead, monofilament, and
swirl.
Select Cure UV-5 Cure Module: Asymtek's
Select Cure inline UV oven with modular
design, ideal for curing topside, bottom-side or
both sides of PCBs in a mid- to high-volume
production environment. Coating materials are
cured using ultra-violet light.
Select Cure UV-6 Cure Module: Asymtek's
Select Cure inline UV oven with modular
design, ideal for topside curing in a mid- to
high-volume production environment. Coating
materials are cured using ultra-violet light.
SEMI: Semiconductor Equipment and Materials
International. An organization that defines
protocols for the semiconductor industry.
Service Shutdown: When all dispensing is
stopped and the dispensing system is made safe
so that servicing can be performed.