Product Data Sheet / Brochure

QuickSpecs
HP EliteBook 860 16 inch G9 Notebook PC
Technical Specifications
Not all configuration components are available in all regions/countries.
c08049273— DA16996 — Worldwide — Version 2 — June 10, 2022
Page 22
Operating Temperature
32° to 158°F (0° to 70°C) [ambient temp]
Features
Pyrite 2.0; TRIM; L1.2
SSD 2TB 2280 PCIe-4x4
NVMe Three Layer Cell
Form Factor
M.2 2280
Capacity
2TB
NAND Type
TLC
Height
0.09 in (2.3 mm)
Width
0.87 in (22 mm)
Weight
0.02 lb (10 g)
Interface
PCIe NVMe Gen4X4
Maximum Sequential Read
6400 MB/s ±20%
Maximum Sequential Write
5000 MB/s ±20%
Logical Blocks
4,000,797,360
Operating Temperature
32° to 158°F (0° to 70°C) [ambient temp]
Features
Pyrite 2.0; TRIM; L1.2
256GB PCIe-4x4 2280 NVME
Self Encrypted OPAL2
Three Layer Cell Solid State
Drive
Form Factor
M.2 2280
Capacity
256GB
NAND Type
TLC
Height
0.09 in (2.3 mm)
Width
0.87 in (22 mm)
Weight
0.02 lb (10 g)
Interface
PCIe NVMe Gen4X4
Maximum Sequential Read
4000 MB/s ±20%
Maximum Sequential Write
2000 MB/s ±20%
Logical Blocks
500,118,192
Operating Temperature
32° to 158°F (0° to 70°C) [ambient temp]
Features
TCG Opal 2.0; TRIM; L1.2
512GB PCIe-4x4 2280 NVME
Self Encrypted OPAL2
Three Layer Cell Solid State
Drive
Form Factor
M.2 2280
Capacity
512GB
NAND Type
TLC
Height
0.09 in (2.3 mm)
Width
0.87 in (22 mm)
Weight
0.02 lb (10 g)
Interface
PCIe NVMe Gen4X4
Maximum Sequential Read
6400 MB/s ±20%
Maximum Sequential Write
3500 MB/s ±20%