Integration Guide
Table Of Contents
- 1 Introduction
- 2 Module Power
- 3 Interfaces
- 4 Hardware Design Guidelines
- Advanced Tips for an RF-Friendly Layout
- Audio Reference Design
- Control Connector Signal Descriptions and Functions
- Module Power (PINS 87, 89, 91, 93, 95, 97, 99)
- Modem Power-on and Recovery Techniques
- Power Switch Logic Detect (Pin 85)
- ON/OFF (PIN 37)
- Phone On - PON (PIN 35)
- Internal Power Switch
- Voltage Reference - VREG_MSME1.8 (PIN 77)
- USB (PINS 1, 3, 5, 7)
- General Purpose Input/Output Interface
- RTC Sleep
- Serial Interfaces and Handshake (Pins 11, 13, 15, 17, 19, 21, 23, 25)
- UART 2 (Pins 27, 29)
- Digital Audio Interface (Pins 12, 14, 16, 18)
- 32 kHz Output (PIN 56)
- Analog-to-Digital Inputs (PIN 44 and 74)
- Handset Microphone Input (PINS 65, 67)
- Handset Microphone BIAS Output (PINS 53, 63)
- Handset Speaker Output (PINS 71, 73)
- Headset Microphone Input (PIN 55)
- Headset Speaker Output Left and Right (PINS 57, 59)
- Headset Detect (PIN 47)
- Circuit Protection
- 5 USB Driver Installation
- 19 -
Use the following guidelines to successfully implement your PCB layout to obtain the best
performance, the lowest possible EMI emissions, the maximum thermal conduction, the
highest mechanical integrity, and the best voice quality. The HS 3001 module is a compact,
high performance design, yet it is easy to interface into the final product. To experience its full
potential, designers should pay close attention to ground structures, the routing of RF and
Digital traces, and the size of the power supply lines.
These design tips are strictly guidelines and are not meant to be a complete list
of items that guarantee actual performance. Each application is different and may
require variation from these guidelines; however, you should try to use these
sound engineering principles.
Advanced Tips For An RF-Friendly Layout
Use the following tips for an RF-friendly layout:
Ground Plane
To ensure the lowest possible EMI emissions and maximum thermal conductivity, Novatel
Wireless M2M recommends that you solder all metal tabs on the cellular module shield down
onto a continuous ground plane that runs under the entire module. Provide ample ground vias
around the metal tabs to create a low impedance ground. Minimize the number of I/O and
power traces and vias under the cellular module to allow for as much ground plane as
possible. Great care should also be taken to avoid any shorting or coupling of vias that might
be placed under the radio module and have them masked.
An example of a good ground structure and pad layout follows: