Integration Guide
Table Of Contents
- 1 Introduction
- 2 Module Power
- 3 Interfaces
- 4 Hardware Design Guidelines
- Advanced Tips for an RF-Friendly Layout
- Audio Reference Design
- Control Connector Signal Descriptions and Functions
- Module Power (PINS 87, 89, 91, 93, 95, 97, 99)
- Modem Power-on and Recovery Techniques
- Power Switch Logic Detect (Pin 85)
- ON/OFF (PIN 37)
- Phone On - PON (PIN 35)
- Internal Power Switch
- Voltage Reference - VREG_MSME1.8 (PIN 77)
- USB (PINS 1, 3, 5, 7)
- General Purpose Input/Output Interface
- RTC Sleep
- Serial Interfaces and Handshake (Pins 11, 13, 15, 17, 19, 21, 23, 25)
- UART 2 (Pins 27, 29)
- Digital Audio Interface (Pins 12, 14, 16, 18)
- 32 kHz Output (PIN 56)
- Analog-to-Digital Inputs (PIN 44 and 74)
- Handset Microphone Input (PINS 65, 67)
- Handset Microphone BIAS Output (PINS 53, 63)
- Handset Speaker Output (PINS 71, 73)
- Headset Microphone Input (PIN 55)
- Headset Speaker Output Left and Right (PINS 57, 59)
- Headset Detect (PIN 47)
- Circuit Protection
- 5 USB Driver Installation
- 29 -
Control Connector Signal Descriptions And
Functions
Unless otherwise noted in the following sections, all digital signals will reference the following
specifications:
Parameter Parameter/Conditions Comments MIN TYP MAX UNIT
V
IH
High level Input voltage 1.17 1.83 V
V
IL
Low level Input voltage -0.3 0.63 V
V
SHYS
Schmitt hysteresis voltage 15 mV
I
L
Input leakage current V
DDX
= Max
V
IN
= 0 V to V
DDM
200 nA
V
OH
High level output voltage I
OUT
= I
OH
1.35 1.8 V
V
OL
Low level output voltage I
OUT
= I
OL
0 0.45 V
I
OH
High level output voltage 3 mA
I
OL
Low level output voltage CMOS, at pin rated drive
strength
3 mA
C
IN
Input Capacitance 5 pF
Module Power (PINS 87, 89, 91, 93, 95, 97, 99)
The HS 3001 module uses a single voltage source of V
CC
= +3.4 V to 4.4 V.
VBAT Parameter/Conditions
Min
(mA)
Typ
(mA)
Max
(mA)
Units
Main Battery Supply Voltage In Regulation 3.4 4.4 Vdc
Peak Current 1000 µF on Host at Module Connector 600mA 680mA mA
The uplink burst will cause strong ripple on the voltage lines and should be
filtered effectively. We recommend that 1000 µF of capacitance be placed as
close to the modem I/O connector as possible. It should be noted that the input
voltage level should not drop below the minimum voltage rating under any
circumstances, especially during the uplink burst period.