User's Manual
Table Of Contents
- 1 Introduction
- 2 Module Power
- 3 Physical Interfaces
- Module Mounting to Host Board (Reference)
- Connectors
- Connectors
- I/O Connector Pin Assignments
- Circuit Protection
- Antenna
- Control Connector Signal Functions
- Module Power (Pins 85, 87, 89, 91, 93, 95, 97, 99)
- Power Control (Pin 35) - (PWR_CTL)
- Level Translation Reference Power (Pin 77)
- USB (Pins 1, 3, 5, 7, 9)
- General Purpose Input/Output Interface
- RTC Sleep
- Serial Interfaces & Handshake (Pins 11, 13, 15, 17, 19, 21, 23, 25)
- Multi-Channel Serial Interface (MCSI) – (Pins 12, 14, 16, 18)
- VBackup Input (Pin83)
- Using VBackup
- Analog-to-Digital Input (Pin 74)
- Handset Microphone Input (Pins 65, 67)
- Handset Microphone Bias Output (Pin 63)
- Handset Speaker Output (Pins 71, 73)
- Headset Microphone Input (Pin 55)
- Headset Microphone Bias Output (Pin 53)
- Headset Speaker Output Left & Right (Pins 57, 59)
- Headset Output Common Mode (Pin 61)
- Headset Detect (Pin 47)
- Subscriber Identity Module (SIM) Carrier (Pins 76, 78, 80, 82, 84)
- 4 Hardware Design
- General Design Guidelines for Using Novatel Wireless M2M GSM Modules
- Enabling the Transmission Modes for the GSM/GPRS Services
- Voice Communication
- Circuit-Switched Data
- SMS: Short Message Services
- Provisioning The SIM
- GSM Services Supported by the Novatel Wireless M2M Enabler IIIG Module
- GPRS Services Supported by the Novatel Wireless M2M Enabler IIIG Module
- Selecting the GSM Modes of Operation
- 5 Setup and Initialization
- 6 Integration and Testing
45 novatelwireless.com
General Design Guidelines For Using Novatel
Wireless M2M GSM Modules
The following guidelines are provided in an effort to allow Enabler IIIG module users to
successfully implement their PCB layout to obtain the best performance. This includes the
lowest possible EMI emissions, maximum thermal conduction, mechanical integrity, and voice
quality. The Enabler IIIG module is a very compact, high performance design, yet it is easy to
interface into the final product. In order to realize its full potential, designers should pay close
attention to ground structures, the routing of RF and Digital traces, and the size of the power
supply lines.
Warning: These design tips are strictly guidelines and are not meant to be a
complete list of items that guarantee actual performance. Each application is
different and may require variation from these guidelines, however, care should
be given to utilize these sound engineering principles whenever possible
Advanced Tips For An RF Friendly Layout
To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is
recommended that all metal tabs on the GSM module shield must be soldered down onto a
continuous ground plane that runs under the entire module. Ample ground vias should be
provided around the metal tabs to create a low impedance ground. It is recommended to
minimize the number of I/O and power traces and vias under the GSM module to allow for as
much ground plane as possible. An example of a good ground structure and pad layout is
shown below in Figure 1.