Datasheet

THERMO PADS
1-366
NTE Electronics, Inc. D Voice [phone] D FAX [phone] D http://www.nteinc.com
NTE's THERMO-PADS do away with the old
fashioned mica wafer and conductive grease
method of mounting power semiconductors.
These thermally conductive insulators offer
low heat transfer resistance while still provid‐
ing high electrical isolation between the parts
of the assembly. The elastomeric material
combines the electrical isolation of rigid insu‐
lators with the ability to conform to rough sur‐
faces and reduce contact resistance in much
the same manner as thermal greases. Proper
selection and use of these THERMO-PADS
results in a securely-mounted power semi‐
conductor and minimum resistance to the
heat transfer between it and the heat sink.
INSTALLED COST PER THOUSAND UNITS
THERMO-PAD
TOTAL $80.00
MICA
GREASE
TOTAL $180.00
PRE-GREASED
MICA
TOTAL $130.00
MATERIALS
LABOR
$175
150
125
100
75
50
25
TYPICAL COST PER THOUSAND
Note: NTE425 is a self-adhesive, thermal interface pad for
use in computer applications. For additional information, refer
to page 1-356.
Tensile Strength
(psi) / (MPa) 3000 ASTM D 412
TYPICAL PROPERTIES
0.009 INCH TEST
PROPERTY THICKNESS METHOD
Construction Silicone/Fiberglass -
Breaking Strength
Lbs./Inch 30 ASTM D 1458
Elongation,
(%45°n to Warp and Fill) 54 ASTM D 412
Volume Resistivity
(Ohm - Meter) 10
11
ASTM D 257
Dielectric Breakdown
Voltage (VAC) 4500 ASTM D 149
Dielectric Constant
(1000 H
Z
) 5.5 ASTM D 150
Continuous Use
Temperature (°C) -60° to +180° -
Thermal Conductivity
W
m-k 0.9 -
Hardness, Shore A 85 ASTM D 2240
Thickness
(Expressed in Inches) 0.009
±
0.001
-
Thermal Performance
(TO220 Test @ 50psi °C/W) 6.61 -
Color Gray Visual
Flame Rating V-O U.L. 94
Thermal Impedance (Note 1)
(Test @ 50psi °C-in
3
/W) 1.45 -
Note 1. The ASTM D 5470 test fixture was used. The recorded
value includes interfacial thermal resistance. These
values are provided for reference only. Actual applica‐
tion performance is directly related to the surface
roughness, flatness and pressure applied.