Datasheet

ManualsBrandsnVent Schroff ManualsDevelopment Boards & KitsTest adapter card, 96/96-pin

Edition 23

10. Backplanes

Main Catalogue

Summary of content (34 pages)

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Main Catalogue Edition 23 10.
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Buch Backplane.book Seite 0 Dienstag, 21. April 2009 4:16 16 PROLINE Overview ........... 0 Backplanes Cabinets ............ 1 Wall mounted cases ............... 2 Accessories for cabinets and wall mounted cases .... 3 VME backplanes Climate control .... 4 VME64x backplanes Desk-top cases .... 5 Subracks/ 19" chassis ......... 6 Front panels, plug-in units ....... 7 VXS backplanes Systems ............ 8 CPCI backplanes and bridges Power supply units ................ 9 Backplanes .......
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MicroTCA Buch Backplane.book Seite 1 Dienstag, 21. April 2009 4:16 16 Backplanes Overview . . . . 10.0 Backplanes 10.2 VMEbus Monolithic J1/J2 . 10.4 J1 (3 U) . . . . . . . 10.5 J2 (3 U) . . . . . . . 10.6 PSB and H.110 backplanes VME64 extension Monolithic VME64x . . . . . . . 10.7 VXS backplanes. . 10.8 CompactPCI CPCI Express backplanes System slot on the right . . . . . . . . . System slot on the left . . . . . . . . . . Packet Switching, H.110 backplanes Bridge . . . . . . . .
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Buch Backplane.book Seite 2 Donnerstag, 23. April 2009 11:43 23 Backplanes Our competence in overview Main CataloguePart number in bold face type: ready for despatch within 2 working daysPart number in normal type: ready for despatch within 10 working days Comprehensive standard backplane programme ATCA - MicroTCA - CompactPCI - VME - Schroff offers you an extensive programme of standard backplanes already optimised to your requirements.
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Buch Backplane.book Seite 3 Donnerstag, 23. April 2009 11:43 23 Backplanes Our competence in overview Modern machine facilities in Straubenhardt Solder paste printing is one of the quality-defining process steps in backplane manufacture. This solder-paste printer, based on innovative inkjet technology, allows fast, flexible and highly dependable solder paste printing. Since the process dispenses with the ’stencils’ required by other methods, the printing program can be changed in a very short time.
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Buch Backplane.book Seite 4 Donnerstag, 23.
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Buch Backplane.book Seite 6 Donnerstag, 23.
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Buch Backplane.book Seite 7 Donnerstag, 23. April 2009 11:43 23 Backplanes – VME64 extension Monolithic VME64x backplanes (6 U) VME64 extension Conforms to: ANSI/VITA 1-1994 VME64 Standard ANSI/VITA 1.1-1997 VME64 Extension Standard ANSI/VITA 1.5-2003 VME2eSST Specification ANSI/VITA 1.
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Buch Backplane.book Seite 8 Donnerstag, 23. April 2009 11:43 23 Backplanes – VMEbus VXS backplanes VMEbus Conforms to ANSI/VITA 41 VXS VMEbus Switched Serial Standard ANSI/VITA 1-1994 VME64 Standard ANSI/VITA 1.1-1997 VME64 Extension Standard ANSI/VITA 1.5-2003 VME2eSST Specification ANSI/VITA 1.
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Buch Backplane.book Seite 9 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI CompactPCI backplane with system slot on the right CompactPCI Conforms to: – – – – PICMG 2.0 R3.0 CompactPCI Core Specification PICMG 2.1 R2.0 Hot-swap Specification PICMG 2.9 R1.0 System Management Bus Specification PICMG 2.10 R1.0 Keying Specification Versions: 3 U 32-bit and 64-bit, 6 U 64-bit, with system slot to right V (I/O) on +3.
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Buch Backplane.book Seite 10 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI CompactPCI backplanes with system slot on the left Conforms to – – – – PICMG 2.0 R3.0 CompactPCI core specification PICMG 2.1 R2.0 Hot-swap Specification PICMG 2.9 R1.0 System Management Bus Specification PICMG 2.10 R1.0 Keying Specification Versions: 3 U 32-bit and 64-bit, 6 U 64-bit, with system slot to left V (I/O) on +3.
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Buch Backplane.book Seite 11 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI CompactPCI backplanes Conforms to – – – – – – – PICMG 2.0 R3.0 CompactPCI Core Specification PICMG 2.1 R2.0 Hot-swap Specification PICMG 2.9 R1.0 System Management Bus Specification PICMG 2.10 R1.0 Keying Specification PICMG 2.5 Computer Telephony Specification (H.110) PICMG 2.16 CompactPCI Packet-Switching Backplanes PICMG 2.
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Buch Backplane.book Seite 12 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI CompactPCI bridges Conforms to – PICMG 2.6 CompactPCI Bridging Specification – PCI 2.1 PCI Local Bus Specification, Rev. 2.
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Buch Backplane.book Seite 13 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI Secondary CompactPCI backplanes, system slot to the right Conforms to: – PICMG 2.0 R3.0 CompactPCI Core Specification – PICMG 2.1 R2.0 Hot-swap Specification – PICMG 2.9 R1.0 System Management Bus Specification PICMG 2.10 R1.
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Buch Backplane.book Seite 14 Donnerstag, 23. April 2009 11:43 23 Backplanes – CompactPCI CompactPCI Express backplane Conforms to – PICMG 2.0 R3.0 CompactPCI Core Specification – PICMG EXP.0 R1.0 Combination of the parallel CompactPCI bus and the serial CompactPCI Express on one backplane One CompactPCI and one CompactPCI Express system slot in centre of backplane CPCI Express system slot in 4-link configuration V(I/O) on +3.
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Buch Backplane.book Seite 15 Donnerstag, 23. April 2009 11:43 23 Backplanes – PXI backplanes PXI backplanes PXI backplanes Conforms to – – – – – PXI Specification R 2.0 PICMG 2.0 R3.0 CompactPCI Core Specification PICMG 2.1 R2.0 Hot-swap Specification PICMG 2.9 R1.0 System Management Bus Specification PICMG 2.10 R1.
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Buch Backplane.book Seite 16 Donnerstag, 23. April 2009 11:43 23 Backplanes – Power backplanes Power backplanes with P47 connector Power backplanes Conforms to – PICMG 2.9 R1.0 System Management Bus Specification – PICMG 2.11 R1.
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Buch Backplane.book Seite 17 Donnerstag, 23.
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Buch Backplane.book Seite 18 Donnerstag, 23. April 2009 11:43 23 Backplanes – AdvancedTCA AdvancedTCA backplanes AdvancedTCA Conforms to PICMG 3.0 R3.0 AdvancedTCA Base Specification PICMG 3.1 R1.0 Ethernet/Fibre Channel PICMG 3.2 R1.0 InfiniBand PICMG 3.3 R1.0 StarFabric PICMG 3.4 R1.0 PCI Express PICMG 3.5 R1.0 RapidIO Data rate: Min.
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Buch Backplane.book Seite 19 Donnerstag, 23. April 2009 11:43 23 Backplanes – MicroTCA MicroTCA backplanes for subracks MicroTCA Conforms to PICMG MicroTCA R1.0 Base Specification PICMG AMC.0 R1.0 or AMC.0 R2.0 AdvancedMC Base Specification PICMG AMC.1 R1.0 PCI Express and Advanced Switching PICMG AMC.2 R1.0 Ethernet PICMG AMC.3 R1.0 AMC Storage Data rate: 12.
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Buch Backplane.book Seite 20 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type B For DIN 41612 connectors, type B Measuring field for current and voltage measurement (U/I), (a) Header with pin diameter 0.
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Buch Backplane.book Seite 21 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type C For DIN 41612 connectors, type C 2 different measuring fields: – current and voltage measurement (U/I): pluggable test bridges – voltage measurement (V): soldered test bridges Connector type C64: Header with pin diameter 0.
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Buch Backplane.book Seite 22 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type D For DIN 41612 connectors, type D 2 different measuring fields: – current and voltage measurement (U/I): pluggable test bridges – voltage measurement (V): soldered test bridges Header with pin diameter 0.
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Buch Backplane.book Seite 23 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type E For DIN 41612 connectors, type E Measuring field for current and voltage measurement (U/I), (a) Header with pin diameter 0.
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Buch Backplane.book Seite 24 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type F For DIN 41612 connectors, type F 2 different measuring fields: – current and voltage measurement (U/I): pluggable test bridges – voltage measurement (V): soldered test bridges Header with pin diameter 0.
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Buch Backplane.book Seite 25 Donnerstag, 23.
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Buch Backplane.book Seite 26 Donnerstag, 23. April 2009 11:43 23 Test adaptors Test adaptors, type M For DIN 41612 connectors, type M 2 versions: - M (F/H): with high-current contacts (H) - M (C/coax): with coaxial connector contact Measuring field for current and voltage measurement (U/I) measuring field versions M (F/H): – F: measurement lugs (a) and measurement pins (b) with jumpers H: test bridges (c) (diameter 4 mm) – M (C/coax): C: test bridge pluggable, header with pin diameter 0.
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10_11_backplanes_testadapters_e_.fm Seite 27 Mittwoch, 29. April 2009 8:36 20 Test adaptors Test adaptors for VMEbus Layout of conductive tracks and layer build-up match the requirements of the VME bus Measuring field version for current and voltage measurement (V/I), (a) Additional measuring pins, e.g.
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Buch Backplane.book Seite 28 Donnerstag, 23.
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Buch Backplane.book Seite 29 Donnerstag, 23.
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Buch Backplane.book Seite 30 Donnerstag, 23. April 2009 11:43 23 Test adaptors – accessories Type/board versions Epoxy fibreglass EP-GC02 to DIN 40802 (FR4). Outlying connections (e.g. pins 1a, b, c and pins 32a, b, c) each have a wider PCB track or large-surface tracks on inner layers – e.g. for shielding, Vcc, GND. Type 1L 2L 4L PCB single-sided, laminated (suitable for up to 2 MHz) PCB, double-sided, laminated and through-connected (suitable for up to approx.
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Buch Backplane.book Seite 31 Donnerstag, 23. April 2009 11:43 23 Backplanes – ServicePLUS configuration Simple. Fast. For the product you want. Equipped to customer specification Suitable solutions from our off-the-shelf programme or individual solutions Equipment options: e.g.: Do not fit unused connectors, VME with ADC or MDC, set CPCI to 3.3V, … Online configuration enquiry: www.schroff.co.uk/configuration modification Small changes. Large impact.
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