User Manual

ManualsBrandsNXP Laboratories UK ManualsAudio EquipmentIEEE 802.15.4 Wireless Microcontroller

Table Of Contents

1 Introduction
- 1.1 Wireless Transceiver
- 1.2 RISC CPU and Memory
- 1.3 Peripherals
- 1.4 Block Diagram
2 Pin Configurations
- 2.1 Pin Assignment
- 2.2 Pin Descriptions
3 CPU
4 Memory Organisation
- 4.1 ROM
- 4.2 RAM
- 4.3 OTP eFuse Memory
- 4.4 External Memory
  - 4.4.1 External Memory Encryption
- 4.5 Peripherals
- 4.6 Unused Memory Addresses
5 System Clocks
- 5.1 16MHz System Clock
  - 5.1.1 32MHz Oscillator
  - 5.1.2 24MHz RC Oscillator
- 5.2 32kHz System Clock
6 Reset
- 6.1 Internal Power-on Reset
- 6.2 External Reset
- 6.3 Software Reset
- 6.4 Brown-out Detect
- 6.5 Watchdog Timer
7 Interrupt System
- 7.1 System Calls
- 7.2 Processor Exceptions
- 7.3 Hardware Interrupts
8 Wireless Transceiver
- 8.1 Radio
  - 8.1.1 Radio External Components
  - 8.1.2 Antenna Diversity
- 8.2 Modem
- 8.3 Baseband Processor
- 8.4 Security Coprocessor
- 8.5 Location Awareness
- 8.6 Higher Data Rates
9 Digital Input/Output
10 Serial Peripheral Interface
11 Timers
- 11.1 Peripheral Timer/Counters
- 11.2 Tick Timer
- 11.3 Wakeup Timers
  - 11.3.1 RC Oscillator Calibration
12 Pulse Counters
13 Serial Communications
- 13.1 Interrupts
- 13.2 UART Application
14 JTAG Debug Interface
15 Two-Wire Serial Interface
- 15.1 Connecting Devices
- 15.2 Clock Stretching
- 15.3 Master Two-wire Serial Interface
- 15.4 Slave Two-wire Serial Interface
16 Four-Wire Digital Audio Interface
17 Random Number Generator
18 Sample FIFO
19 Intelligent Peripheral Interface
- 19.1 Data Transfer Format
- 19.2 JN5148 (Slave) Initiated Data Transfer
- 19.3 Remote (Master) Processor Initiated Data Transfer
20 Analogue Peripherals
- 20.1 Analogue to Digital Converter
- 20.2 Digital to Analogue Converter
  - 20.2.1 Operation
- 20.3 Comparators
21 Power Management and Sleep Modes
- 21.1 Operating Modes
  - 21.1.1 Power Domains
- 21.2 Active Processing Mode
  - 21.2.1 CPU Doze
- 21.3 Sleep Mode
- 21.4 Deep Sleep Mode
22 Electrical Characteristics
- 22.1 Maximum Ratings
- 22.2 DC Electrical Characteristics
- 22.3 AC Characteristics
Appendix A Mechanical and Ordering Information
- A.1 56-pin QFN Package Drawing
- A.2 PCB Decal
- A.3 Ordering Information
- A.4 Device Package Marking
- A.5 Tape and Reel Information
Appendix B Development Support
- B.1 Crystal Oscillators
- B.2 32MHz Oscillator
- B.3 32kHz Oscillator
- B.4 JN5148 Module Reference Designs
  - B.4.1 Schematic Diagram
  - B.4.2 PCB Design and Reflow Profile
- Related Documents
- RoHS Compliance
- Status Information
- Disclaimers
- Version Control
- Contact Details

Jennic

Preliminary

A.5.3 Reel Information: 330mm Reel

Surface Resistivity Between 10e

– 10e

Ohms Square

Material High Impact Polystyrene with Antistatic Additive

All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.

3 window design to allow adequate labelling space.

Tape Width A B (min) C D (min) N (min) W (min) W (max)

16 330 1.5 13 +0.5 -0.2 20.2 100 15.90 19.40

A.5.4 Dry Pack Requirement for Moisture Sensitive Material

Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 56 lead QFN

package is MSL2A/260

C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at

67.5 grams of activated clay and a 6 spot humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB

has a moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.