User's Manual

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10 JN-DS-JN5148-001-Myy 1v1 © Jennic 2009
5.3. Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 2 as a guide, as well as the paste
manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates.
Figure 2: Recommended solder reflow profile
Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp
(235ºC)
Target Time (s) 90~130 30~60 20~50 10~15 160~270