Datasheet

2N7002P All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 29 July 2010 11 of 15
NXP Semiconductors
2N7002P
60 V, 360 mA N-channel Trench MOSFET
10. Soldering
Fig 19. Reflow soldering footprint for SOT23 (TO-236AB)
Fig 20. Wave soldering footprint for SOT23 (TO-236AB)
solder lands
solder resist
occupied are
a
solder paste
sot023_
fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied are
a
preferred transport direction during soldering
sot023_
fw
2.8
4.5
1.4
4
.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm