Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Ordering information
- 4. Functional diagram
- 5. Pinning information
- 6. Functional description
- 7. Limiting values
- 8. Recommended operating conditions
- 9. Static characteristics
- 10. Dynamic characteristics
- 11. Waveforms
- 12. Package outline
- 13. Abbreviations
- 14. Revision history
- 15. Legal information
- 16. Contact information
- 17. Contents

74ABT125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 3 November 2011 10 of 16
NXP Semiconductors
74ABT125
Quad buffer; 3-state
Fig 11. Package outline SOT337-1 (SSOP14)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65 1.25 0.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
8
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1
99-12-27
03-02-19
(1)
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
1
7
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
A
max.
2