Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Receiver, transceiver TSSOP 20

1. General description

The 74AHC245; 74AHCT245 is a high-speed Si-gate CMOS device.

The 74AHC245; 74AHCT245 is an octal transceiver featuring non-inverting 3-state bus

compatible outputs in both send and receive directions.

The 74AHC245; 74AHCT245 features an output enable input (OE), for easy cascading,

and a send and receive direction control input (DIR).

OE controls the outputs so that the buses are effectively isolated.

2. Features

n Balanced propagation delays

n All inputs have Schmitt-trigger actions

n Inputs accept voltages higher than V

n Input levels:

u For 74AHC245: CMOS level

u For 74AHCT245: TTL level

n ESD protection:

u HBM EIA/JESD22-A114E exceeds 2000 V

u MM EIA/JESD22-A115-A exceeds 200 V

u CDM EIA/JESD22-C101C exceeds 1000 V

n Multiple package options

n Speciﬁed from −40 °C to +85 °C and from −40 °C to +125 °C

3. Ordering information

74AHC245; 74AHCT245

Octal bus transceiver; 3-state

Rev. 05 — 28 April 2009 Product data sheet

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74AHC245D −40 °C to +125 °C SO20 plastic small outline package; 20 leads;

body width 7.5 mm

SOT163-1

74AHCT245D

74AHC245PW −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT360-1

74AHCT245PW

74AHC245BQ −40 °C to +125 °C DHVQFN20 plastic dual in-line compatible thermal enhanced

very thin quad ﬂat package; no leads; 20 terminals;

body 2.5 × 4.5 × 0.85 mm

SOT764-1

74AHCT245BQ

Summary of content (16 pages)

PAGE 1
74AHC245; 74AHCT245 Octal bus transceiver; 3-state Rev. 05 — 28 April 2009 Product data sheet 1. General description The 74AHC245; 74AHCT245 is a high-speed Si-gate CMOS device. The 74AHC245; 74AHCT245 is an octal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74AHC245; 74AHCT245 features an output enable input (OE), for easy cascading, and a send and receive direction control input (DIR).
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 4. Functional diagram 1 DIR OE 2 B0 3 19 3EN1 3EN2 1 14 18 3 17 4 16 13 5 15 6 14 7 13 8 12 A6 12 A7 B7 11 9 Logic symbol Fig 2. IEC logic symbol 74AHC_AHCT245_5 Product data sheet 11 mna175 mna174 Fig 1. 2 A5 B6 9 G3 2 B5 8 15 A4 B4 7 1 16 A3 B3 6 17 A2 B2 5 18 A1 B1 4 19 A0 © NXP B.V. 2009. All rights reserved. Rev.
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 5. Pinning information 5.
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 2. Pin description …continued Symbol Pin Description B1 17 data input/output B0 18 data input/output OE 19 output enable input (active LOW) VCC 20 supply voltage 6. Functional description Table 3. Function table[1] Control Input/output OE DIR An Bn L L A=B inputs L H inputs B=A H X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7.
PAGE 5
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V 74AHC245 VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74AHCT245 VCC supply voltage 4.
PAGE 6
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.
PAGE 7
4AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter 25 °C Conditions Min Typ[1] CL = 15 pF - CL = 50 pF - −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max 5.0 8.4 1.0 10.0 1.0 10.5 ns 6.5 11.9 1.0 13.5 1.0 15.0 ns 3.5 5.5 1.0 6.5 1.0 7.0 ns 5.0 7.5 1.0 8.5 1.0 9.
PAGE 8
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7. Symbol Parameter tdis disable time 25 °C Conditions Min Max Min Max Min Max - 5.0 14.4 1.0 15.5 1.0 18.0 ns - 6.0 15.4 1.0 16.5 1.0 19.
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state VI OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PHZ VOH t PZH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna367 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Enable and disable times Table 8. Measurement points Type Input Output VM VM VX VY 74AHC245 0.
PAGE 10
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 7.
PAGE 11
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 11. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.
PAGE 12
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.
PAGE 13
74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b 1 0.05 0.00 0.30 0.
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 12. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 13. Revision history Table 11.
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74AHC245; 74AHCT245 NXP Semiconductors Octal bus transceiver; 3-state 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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NXP Semiconductors 74AHC245; 74AHCT245 Octal bus transceiver; 3-state 16. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 10.1 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . .