INTEGRATED CIRCUITS DATA SHEET 74ALVC16244; 74ALVCH16244 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 FEATURES DESCRIPTION • Wide supply voltage range from 1.2 to 3.6 V The 74ALVC16244; 74ALVCH16244 is a 16-bit non-inverting buffer/line driver with 3-state outputs. The device can be used as four 4-bit buffers, two 8-bit buffers or one 16-bit buffer. The 3-state outputs are controlled by the output enable inputs 1OE, 2OE, 3OE and 4OE.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 FUNCTION TABLE See note 1 INPUT OUTPUT nOE nAn nYn L L L L H H H X Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
Philips Semiconductors Product specification 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) handbook, halfpage 1 48 74ALVC16244; 74ALVCH16244 1EN 2EN 25 3EN 24 4EN 47 1 1 2 46 3 44 5 43 6 41 1 2 9 38 11 37 12 1 3 14 33 16 32 17 1 4 To internal circuit Data input 13 35 30 VCC 8 40 36 handbook, halfpage MNA998 19 29 20 27 22 26 23 MNA997 Fig.3 Logic symbol (IEEC/IEC). Fig.4 Bus hold circuit.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage IIK input diode current VI input voltage CONDITIONS MIN. MAX. UNIT −0.5 +4.6 V VI < 0 − −50 mA for data inputs with bus hold; note 1 −0.5 VCC + 0.5 V for data inputs without bus hold; note 1 −0.5 +5.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER TYP.(1) MIN. OTHER MAX. UNIT VCC (V) Tamb = −40 to +85 °C VIH VIL VOH VOL ILI IIHZ, IILZ IOZ ICC HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL voltage IO = −100 µA 1.2 VCC − − V 1.8 0.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 TEST CONDITIONS SYMBOL PARAMETER ∆ICC additional quiescent supply current per pin TYP.(1) MIN. OTHER MAX. UNIT VCC (V) VI =VCC − 0.6 V; IO = 0 2.7 to 3.6 − 150 750 µA data pin without bus hold 2.7 to 3.6 − 5 500 µA control pin data pin with bus hold 2.7 to 3.6 − 5 500 µA bus hold LOW VI = 0.7 V; note 2 sustaining current VI = 0.8 V; note 2 2.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 AC CHARACTERISTICS GND = 0 V; tr = tf ≤ 2.0 ns and CL = 30 pF for VCC < 2.7 V; tr = tf ≤ 2.5 ns and CL = 50 pF for VCC ≥ 2.7 V. TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP. MAX.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 VI handbook, full pagewidth nOE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled MNA999 VM = 0.5VCC at VCC < 2.7 V and VM = 1.5 V at VCC ≥ 2.7 V. VX = VOL + 0.15 V at VCC < 2.7 V and VX = VOL + 0.3 V at VCC ≥ 2.7 V. VY = VOH − 0.15 V at VCC < 2.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 PACKAGE OUTLINES SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 25 48 Q A2 A1 A (A 3) θ pin 1 index Lp L 24 1 detail X w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.8 0.4 0.2 2.35 2.20 0.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 To overcome these problems the double-wave soldering method was specifically developed. SOLDERING Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology.
Philips Semiconductors Product specification 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.3 V 16-bit buffer/line driver (3-state) 74ALVC16244; 74ALVCH16244 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date.
Philips Semiconductors Product specification 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.
Philips Semiconductors Product specification 2.5 V/3.
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