Datasheet

74AUP1G08 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 6 — 22 June 2012 2 of 21
NXP Semiconductors
74AUP1G08
Low-power 2-input AND gate
3. Ordering information
4. Marking
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74AUP1G08GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74AUP1G08GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1.45 × 0.5 mm
SOT886
74AUP1G08GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 1 × 1 × 0.5 mm
SOT891
74AUP1G08GN −40 °C to +125 °C XSON6 extremely thin small outline package; no leads;
6 terminals; body 0.9 × 1.0 × 0.35 mm
SOT1115
74AUP1G08GS −40 °C to +125 °C XSON6 extremely thin small outline package; no leads;
6 terminals; body 1.0 × 1.0 × 0.35 mm
SOT1202
74AUP1G08GX −40 °C to +125 °C X2SON5 X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8 × 0.8 × 0.35 mm
SOT1226
Table 2. Marking
Type number Marking code
[1]
74AUP1G08GW pE
74AUP1G08GM pE
74AUP1G08GF pE
74AUP1G08GN pE
74AUP1G08GS pE
74AUP1G08GX pE
Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram
mna113
B
A
Y
2
1
4
mna114
2
4
&
1
mna221
A
B
Y