Datasheet

74AUP1G34 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 6 — 28 June 2012 11 of 20
NXP Semiconductors
74AUP1G34
Low-power buffer
13. Package outline
Fig 10. Package outline SOT353-1 (TSSOP5)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(1)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
e
1
1.3
2.25
2.0
0.60
0.15
7°
0°
0.1 0.10.30.425
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.46
0.21
SOT353-1 MO-203 SC-88A
00-09-01
03-02-19
w M
b
p
D
Z
e
e
1
0.15
13
5
4
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
1.5 3 mm0
scale
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
1.1