Datasheet

74AXP1G125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 16 January 2014 2 of 18
NXP Semiconductors
74AXP1G125
Low-power buffer/line driver; 3-state
3. Ordering information
4. Marking
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74AXP1G125GM 40 C to +85 C XSON6 plastic extremely thin small outline package; no leads;
6 terminals; body 1  1.45  0.5 mm
SOT886
74AXP1G125GN 40 C to +85 C XSON6 extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
SOT1115
74AXP1G125GS 40 C to +85 C XSON6 extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
SOT1202
74AXP1G125GX 40 C to +85 C X2SON5 X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8  0.8  0.35 mm
SOT1226
Table 2. Marking
Type number Marking code
[1]
74AXP1G125GM rM
74AXP1G125GN rM
74AXP1G125GS rM
74AXP1G125GX rM
Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram
mna118
AY
2
1
4
OE
mna119
1
4
2
EN
001aad068
A
OE
Y