Datasheet
Table Of Contents
- 1. General description
- 2. Features and benefits
- 3. Ordering information
- 4. Functional diagram
- 5. Pinning information
- 6. Functional description
- 7. Limiting values
- 8. Recommended operating conditions
- 9. Static characteristics
- 10. Dynamic characteristics
- 11. Waveforms
- 12. Package outline
- 13. Abbreviations
- 14. Revision history
- 15. Legal information
- 16. Contact information
- 17. Contents
74CBTLV3257 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 16 December 2011 2 of 19
NXP Semiconductors
74CBTLV3257
Quad 1-of-2 multiplexer/demultiplexer
3. Ordering information
[1] Also known as QSOP16.
4. Functional diagram
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74CBTLV3257D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width
3.9 mm
SOT109-1
74CBTLV3257DS 40 C to +125 C SSOP16
[1]
plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
74CBTLV3257PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
74CBTLV3257BQ 40 C to +125 C DHVQFN16 plastic dual-in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals; body
2.5 3.5 0.85 mm
SOT763-1
Fig 1. Logic diagram
001aal213
S
OE
1
1A
4
3A
9
2A
7
4A
12
1B1
2
1B2
3
2B1
5
2B2
6
3B1
11
3B2
10
4B1
14
4B2
13
15