INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines 74HC/HCT112 Dual JK flip-flop with set and reset; negative-edge trigger Product specification Supersedes data of December 1990 File under Integrated Circuits, IC06 1998 Jun 10
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 The set and reset inputs, when LOW, set or reset the outputs as shown in the function table regardless of the levels at the other inputs. FEATURES • Asynchronous set and reset • Output capability: standard A HIGH level at the clock (nCP) input enables the nJ and nK inputs and data will be accepted.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME 74HC112D; 74HCT112D 74HC112DB; 74HCT112DB SO16 SSOP16 74HC112N; 74HCT112N 74HC112PW; 74HCT112PW DIP16 TSSOP16 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 plastic shrink small outline package; 16 leads; body width 5.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 FUNCTION TABLE INPUTS OUTPUTS OPERATING MODE nSD nRD nCP nJ nK nQ nQ asynchronous set L H X X X H L asynchronous reset H L X X X L H undetermined L L X X X H L toggle H H ↓ h h q q load “0” (reset) H H ↓ l h L H load “1” (set) H H ↓ h l H L hold “no change” H H ↓ l l q q Note Fig.4 Functional diagram. 1.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 DC CHARACTERISTICS FOR 74HC For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (°C) SYMBOL 74HC PARAMETER +25 min. typ.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 DC CHARACTERISTICS FOR 74HCT For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard ICC category: flip-flops Note to HCT types The value of additional quiescent supply current (∆ICC) for a unit load of 1 is given in the family specifications.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 AC CHARACTERISTICS FOR 74HCT GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (°C) TEST CONDITIONS 74HCT SYMBOL PARAMETER +25 min. −40 to +85 typ. max. min. max. −40 to +125 UNIT VCC (V) WAVEFORMS min. max. tPHL/ tPLH propagation delay nCP to nQ 21 35 44 53 ns 4.5 Fig.6 tPHL/ tPLH propagation delay nCP to nQ 23 40 50 60 ns 4.5 Fig.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 AC WAVEFORMS (1) HC : VM = 50%; VI = GND to VCC. HCT: VM = 1.3 V; VI = GND to 3 V. The shaded areas indicate when the input is permitted to change for predictable output performance. Fig.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 between 50 and 300 seconds depending on heating method. SOLDERING Introduction Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. There is no soldering method that is ideal for all IC packages.
Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 one operation within 2 to 5 seconds between 270 and 320 °C. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.