Datasheet

74HC_HCT30 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 6 — 27 December 2012 11 of 16
NXP Semiconductors
74HC30; 74HCT30
8-input NAND gate
Fig 9. Package outline SOT337-1 (SSOP14)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65 1.25 0.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
8
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1
99-12-27
03-02-19
(1)
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
1
7
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
A
max.
2