74HC365; 74HCT365 Hex buffer/line driver; 3-state Rev. 3 — 5 September 2012 Product data sheet 1. General description The 74HC365; 74HC365 is a hex buffer/line driver with 3-state outputs controlled by the output enable inputs (OEn). A HIGH on OEn causes the outputs to assume a high impedance OFF-state. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC365 74HC365D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HCT365DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width 5.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state EXIIHU OLQH GULYHU 9&& $ < 2( 2( *1' $ $ $ $ $ EXIIHU OLQH GULYHU < EXIIHU OLQH GULYHU < EXIIHU OLQH GULYHU < EXIIHU OLQH GULYHU < EXIIHU OLQH GULYHU < DDD Fig 4. Logic diagram 5. Pinning information 5.1 Pinning +& +&7 2( 9&& $ 2( < $ $ < < $ $ < < $ *1' < DDD Fig 5.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 5.2 Pin description Table 2.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit 0.5 +7 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V - 20 mA IO output current VO = 0.5 V to (VCC + 0.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 9. Static characteristics Table 6. Static characteristics 74HC365 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit Tamb = 25 C VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V 1.5 1.2 - V VCC = 4.5 V 3.15 2.4 - V VCC = 6.0 V 4.2 3.2 - V VCC = 2.0 V - 0.8 0.5 V VCC = 4.5 V - 2.1 1.35 V VCC = 6.
4HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state Table 6. Static characteristics 74HC365 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOL Conditions Min Typ Max Unit IO = 20 A; VCC = 2.0 V - - 0.1 V IO = 20 A; VCC = 4.5 V - - 0.1 V IO = 20 A; VCC = 6.0 V - - 0.1 V IO = 6.0 mA; VCC = 4.5 V - - 0.33 V IO = 7.8 mA; VCC = 6.0 V - - 0.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state Table 7. Static characteristics 74HCT365 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A - 0 0.1 V II input leakage current VI = VCC or GND; VCC = 5.5 V IO = 6.0 mA - 0.16 0.26 V - - 0.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state Table 7. Static characteristics 74HCT365 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 160 A ICC additional supply current VI = VCC 2.1 V; other inputs at VCC or GND; IO = 0 A pins nA - - 490 A pin OE1 - - 490 A pin OE2 - - 441 A 10.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state Table 8. Dynamic characteristics 74HC365 …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; see test circuit Figure 8. Symbol Parameter tdis disable time transition time tt Conditions Min Typ Max Unit VCC = 2.0 V - - 190 ns VCC = 4.5 V - - 38 ns VCC = 6.0 V - - 33 ns VCC = 2.0 V - - 75 ns VCC = 4.5 V - - 15 ns VCC = 6.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state Table 9. Dynamic characteristics 74HCT365 Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; see test circuit Figure 8. Symbol Parameter Conditions Min Typ Max Unit - 14 25 ns Tamb = 25 C propagation delay tpd nA to nY; see Figure 6 [1] VCC = 4.5 V VCC = 5 V; CL = 15 pF - 11 - ns ten enable time OEn to nY; VCC = 4.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 11. Waveforms 9, Q$ LQSXW 90 90 *1' W3+/ W3+/ 92+ Q< RXWSXW 90 90 92/ W7+/ W7+/ DDD Measurement points are given in Table 10. VOL and VOH are typical output voltage levels that occur with the output load. Fig 6.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 11. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch Fig 8.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 12. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 13. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 14. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT365 v.
74HC365; 74HCT365 NXP Semiconductors Hex buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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NXP Semiconductors 74HC365; 74HCT365 Hex buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . .