Datasheet

74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 3 of 18
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
5.2 Pin description
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4. Pin configuration DIP20, SO20, (T)SSOP20 Fig 5. Pin configuration DHVQFN20
74HC244
74HCT244
1OE V
CC
1A0 2OE
2Y0 1Y0
1A1 2A0
2Y1 1Y1
1A2 2A1
2Y2 1Y2
1A3 2A2
2Y3 1Y3
GND 2A3
001aae011
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
001aae012
74HC244
74HCT244
Transparent top view
1Y3
1A3
2Y3
2A2
2Y2 1Y2
1A2 2A1
2Y1 1Y1
1A1 2A0
2Y0 1Y0
1A0 2OE
GND
2A3
1OE V
CC
9
12
8 13
7 14
6 15
5 16
4 17
3 18
2 19
10 11
1
20
terminal 1
index area
GND
(1)
Table 2. Pin description
Symbol Pin Description
1OE
, 2OE 1, 19 output enable input (active LOW)
1A0, 1A1, 1A2, 1A3 2, 4, 6, 8 data input
2Y0, 2Y1, 2Y2, 2Y3 3, 5, 7, 9 bus output
GND 10 ground (0 V)
2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 data input
1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14, 12 bus output
V
CC
20 supply voltage