Datasheet
74LV04_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 4 December 2007 12 of 15
NXP Semiconductors
74LV04
Hex inverter
Fig 12. Package outline SOT762-1 (DHVQFN14)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
3.1
2.9
D
h
1.65
1.35
y
1
2.6
2.4
1.15
0.85
e
1
2
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
26
13
9
8
7
1
14
X
D
E
C
B
A
02-10-17
03-01-27
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)