Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Buffer, driver XSON 6

1. General description

The 74LVC1G125 provides one non-inverting buffer/line driver with 3-state output.

The 3-state output is controlled by the output enable input (OE

). A HIGH-level at pin OE

causes the output to assume a high-impedance OFF-state.

The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of

this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging backflow current through the device

when it is powered down.

2. Features and benefits

 Wide supply voltage range from 1.65 V to 5.5 V

 High noise immunity

 Complies with JEDEC standard:

 JESD8-7 (1.65 V to 1.95 V)

 JESD8-5 (2.3 V to 2.7 V)

 JESD8-B/JESD36 (2.7 V to 3.6 V)

 24 mA output drive (V

=3.0V)

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 CMOS low power consumption

 Inputs accept voltages up to 5 V

 Latch-up performance exceeds 250 mA

 Direct interface with TTL levels

 Multiple package options

 Specified from 40 Cto+85 C and 40 Cto+125C

74LVC1G125

Bus buffer/line driver; 3-state

Rev. 11 — 2 July 2012 Product data sheet

Summary of content (20 pages)

PAGE 1
74LVC1G125 Bus buffer/line driver; 3-state Rev. 11 — 2 July 2012 Product data sheet 1. General description The 74LVC1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH-level at pin OE causes the output to assume a high-impedance OFF-state. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G125GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 6. Pinning information 6.1 Pinning 74LVC1G125 74LVC1G125 1 OE A 2 GND 3 5 4 OE 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC Y 001aaf199 Transparent top view 001aaf198 Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 74LVC1G125 74LVC1G125 1 OE OE 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC 4 Y 3 GND 2 A 001aaf400 aaa-003032 Transparent top view Transparent top view Fig 6.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 7. Functional description Table 4. Function table[1] Input Output OE A Y L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
PAGE 5
74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC Conditions Min Typ Max Unit supply voltage 1.65 - 5.5 V VI input voltage 0 - 5.5 V VO output voltage Active mode 0 - VCC V VCC = 0 V; Power-down mode 0 - 5.5 V 40 - +125 C VCC = 1.65 V to 2.7 V - - 20 ns/V VCC = 2.7 V to 5.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit IOFF power-off leakage current VCC = 0 V; VI or VO = 5.5 V - 0.1 10 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - 0.1 10 A ICC additional supply current per pin; VCC = 2.3 V to 5.5 V; VI = VCC  0.
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4LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10. Symbol Parameter 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 3.3 8.0 1.0 10.5 ns VCC = 2.3 V to 2.7 V 0.5 2.2 5.5 0.5 7 ns VCC = 2.7 V 0.5 2.5 5.5 0.5 7 ns VCC = 3.0 V to 3.6 V 0.5 2.1 4.5 0.5 6 ns VCC = 4.5 V to 5.5 V 0.5 1.7 4.0 0.5 5.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 12. Waveforms VI VM A input GND t PHL t PLH VOH VM Y output VOL mnb153 Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 8.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 10. Test circuit for measuring switching times Table 10.
PAGE 10
74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e e1 0.6 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 e1 4 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm 1 SOT1202 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 Note 1. Including plating thickness. 2.
PAGE 16
74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm B A D SOT1226 X A E A1 A3 detail X terminal 1 index area e C v w b 1 2 terminal 1 index area C A B C y1 C y k D h 3 L 5 4 0 1 mm scale Dimensions Unit mm A(1) A1 A3 D Dh E b e k L max 0.35 0.04 0.128 0.85 0.30 0.85 0.27 0.27 nom 0.80 0.25 0.80 0.22 0.48 0.22 min 0.20 0.17 0.040 0.75 0.20 0.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G125 v.11 20120702 Product data sheet - 74LVC1G125 v.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
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74LVC1G125 NXP Semiconductors Bus buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . .