Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsLogic ICsLogic IC - Buffer, driver TSOP 5

1. General description

The 74LVC1G17 provides a buffer function with Schmitt trigger input. It is capable of

transforming slowly changing input signals into sharply defined outputs.

The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of

this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging backflow current through the device

when it is powered down.

2. Features and benefits

 Wide supply voltage range from 1.65 V to 5.5 V

 High noise immunity

 Complies with JEDEC standard

 JESD8-7 (1.65 V to 1.95 V)

 JESD8-5 (2.3 V to 2.7 V)

 JESD8B/JESD36 (2.7 V to 3.6 V)

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 24 mA output drive (V

=3.0V)

 CMOS low power consumption

 Latch-up performance exceeds 250 mA

 Direct interface with TTL levels

 Unlimited rise and fall times

 Inputs accept voltages up to 5 V

 Multiple package options

 Specified from 40 C to +85 C and from 40 C to +125 C

74LVC1G17

Single Schmitt trigger buffer

Rev. 10 — 29 June 2012 Product data sheet

Summary of content (21 pages)

PAGE 1
74LVC1G17 Single Schmitt trigger buffer Rev. 10 — 29 June 2012 Product data sheet 1. General description The 74LVC1G17 provides a buffer function with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined outputs. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G17GW 40 C to +125 C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer A Y mnb152 Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74LVC1G17 74LVC1G17 n.c. 1 A 2 GND 3 5 4 n.c. 1 6 VCC A 2 5 n.c. GND 3 4 Y VCC Y 001aaf191 001aaf190 Transparent top view Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 74LVC1G17 74LVC1G17 n.c. n.c. 1 6 VCC A 2 5 n.c.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 7. Functional description Table 4. Function table[1] Input Output A Y L L H H [1] H = HIGH voltage level; L = LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit Tamb = 40 C to +85 C VOH VOL HIGH-level output voltage VI = VT+ or VT LOW-level output voltage IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 1.2 - - V IO = 8 mA; VCC = 2.3 V 1.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer Table 7. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V - - 200 A ICC supply current VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A - - 200 A ICC additional supply current per pin; VI = VCC  0.6 V; IO = 0 A; VCC = 2.3 V to 5.
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4LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 10.1 Transfer characteristic waveforms VO VT+ VI VH VT− VT− Fig 8. VO VI VH VT+ mnb155 mnb154 Transfer characteristic Fig 9. Definitions of VT+, VT and VH mna641 10 ICC (mA) 8 6 4 2 0 0 1 2 VI (V) 3 VCC = 3.0 V Fig 10. Typical transfer characteristics 74LVC1G17 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 10 — 29 June 2012 © NXP B.V. 2012. All rights reserved.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 12. Symbol Parameter propagation delay tpd power dissipation capacitance CPD 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ[1] Max Min Max VCC = 1.65 V to 1.95 V 1.0 4.1 11.0 1.0 14.0 ns VCC = 2.3 V to 2.7 V 0.7 2.8 6.5 0.7 8.5 ns VCC = 2.7 V 0.7 3.2 6.5 0.7 8.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer Table 10. Measurement points …continued Supply voltage Input Output VCC VM VM 2.7 V 1.5 V 1.5 V 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5  VCC 0.5  VCC VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer mnb156 50 ICC (mA) (1) 40 30 20 (2) 10 0 2 3 4 5 VCC (V) 6 Linear change of VI between 0.8 V to 2.0 V. (1) Positive-going edge. (2) Negative-going edge. Fig 13. Average supply current as a function of supply voltage 74LVC1G17 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 10 — 29 June 2012 © NXP B.V. 2012. All rights reserved.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 14. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e e1 0.6 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 e1 4 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm 1 SOT1115 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 0.95 1.05 nom 0.15 0.90 1.00 0.55 min 0.12 0.85 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm 1 SOT1202 b 3 2 (4×)(2) L L1 e 6 5 4 e1 e1 (6×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.05 1.05 0.35 0.40 nom 0.15 1.00 1.00 0.55 0.35 0.30 0.35 min 0.12 0.95 0.95 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm B A D SOT1226 X A E A1 A3 detail X terminal 1 index area e C v w b 1 2 terminal 1 index area C A B C y1 C y k D h 3 L 5 4 0 1 mm scale Dimensions Unit mm A(1) A1 A3 D Dh E b e k L max 0.35 0.04 0.128 0.85 0.30 0.85 0.27 0.27 nom 0.80 0.25 0.80 0.22 0.48 0.22 min 0.20 0.17 0.040 0.75 0.20 0.75 0.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 15. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 16. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1G17 v.10 20120629 Product data sheet - 74LVC1G17 v.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
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74LVC1G17 NXP Semiconductors Single Schmitt trigger buffer 19. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 10.1 11 12 13 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information .