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1. General description

The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The

3-state outputs are controlled by the output enable inputs 1OE

and 2OE:

• A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state.

• A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and

fall times.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the

74LVC2G241 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing a damaging backflow current through the device

when it is powered down.

2. Features and benefits

 Wide supply voltage range from 1.65 V to 5.5 V

 5 V tolerant input/output for interfacing with 5 V logic

 High noise immunity

 Complies with JEDEC standard:

 JESD8-7 (1.65 V to 1.95 V)

 JESD8-5 (2.3 V to 2.7 V)

 JESD8-B/JESD36 (2.7 V to 3.6 V)

 ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V

 24 mA output drive (V

=3.0V)

 CMOS low power consumption

 Latch-up performance exceeds 250 mA

 Direct interface with TTL levels

 Inputs accept voltages up to 5 V

 Multiple package options

 Specified from 40 Cto+85C and 40 C to +125 C

74LVC2G241

Dual buffer/line driver; 3-state

Rev. 13 — 8 April 2013 Product data sheet

Summary of content (23 pages)

PAGE 1
74LVC2G241 Dual buffer/line driver; 3-state Rev. 13 — 8 April 2013 Product data sheet 1. General description The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE: • A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. • A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC2G241DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74LVC2G241DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 5. Functional diagram 1OE 1A 1Y 1 EN1 2OE 2A 2Y 2 EN2 001aah844 Fig 1. 001aah845 Logic symbol Fig 2. IEC logic symbol 6. Pinning information 6.1 Pinning 74LVC2G241 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 74LVC2G241 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 001aab570 Transparent top view 001aab569 Fig 3. Pin configuration SOT505-2 and SOT765-1 74LVC2G241 Product data sheet Fig 4.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 74LVC2G241 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 1Y 2A 8 1 7 1OE 2 6 1A 3 5 2Y GND 1OE 2OE 4 74LVC2G241 VCC terminal 1 index area 001aai247 Transparent top view Transparent top view Fig 5. 001aaf057 Pin configuration SOT996-2 Fig 6. Pin configuration SOT902-2 6.2 Pin description Table 3.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] Max Unit 0.5 +6.5 V 50 - mA 0.5 +6.5 V - 50 mA enable mode [1] 0.5 VCC + 0.5 V disable mode [1] 0.5 +6.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max VCC = 1.65 V to 1.95 V 0.65  VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7  VCC - - V VCC = 1.65 V to 1.95 V - - 0.35  VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 2.7 V to 3.
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4LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit VCC = 1.65 V to 1.95 V 0.65  VCC - - V VCC = 2.3 V to 2.7 V 1.7 - - V VCC = 2.7 V to 3.6 V 2.0 - - V VCC = 4.5 V to 5.5 V 0.7  VCC - - V VCC = 1.65 V to 1.95 V - - 0.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter tpd ten 40 C to +85 C Conditions Min Max Min Max VCC = 1.65 V to 1.95 V 1.0 4.5 8.8 1.0 11.0 ns VCC = 2.3 V to 2.7 V 0.5 2.8 4.9 0.5 6.3 ns VCC = 2.7 V 1.0 2.8 4.7 1.0 5.9 ns VCC = 3.0 V to 3.6 V 0.5 2.6 4.3 0.5 5.4 ns VCC = 4.5 V to 5.5 V 0.5 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter CPD [1] power dissipation capacitance 40 C to +125 C Unit Min Typ[1] Max Min Max output enabled - 20 - - - pF output disabled - 5 - - - pF [5] per buffer; VI = GND to VCC Typical values are measured at nominal VCC and at Tamb = 25 C. [2] tpd is the same as tPLH and tPHL.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state VI 1OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna730 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state tW VI 90 % negative pulse VM VM 10 % 0V VI tf tr tr tf 90 % positive pulse VM VM 10 % 0V tW VEXT VCC PULSE GENERATOR VI RL VO DUT RT CL RL 001aae235 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm SOT1089 E terminal 1 index area D A A1 detail X (4×)(2) e L (8×)(2) b 4 5 e1 1 terminal 1 index area 8 L1 X 0 0.5 scale Dimensions Unit mm max nom min 1 mm A(1) 0.5 A1 b D E e e1 L L1 0.35 0.40 0.04 0.20 1.40 1.05 0.15 1.35 1.00 0.55 0.35 0.30 0.35 0.27 0.32 0.12 1.30 0.95 Note 1. Including plating thickness. 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit(1) mm max nom min A A1 b 0.05 0.35 D E 2.1 3.1 0.5 0.00 0.15 1.9 e e1 0.5 1.5 2.9 L L1 L2 0.5 0.15 0.6 0.3 0.05 0.4 v 0.1 w y 0.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-2 X A B D terminal 1 index area E A A1 detail X e v w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L metal area not for soldering L1 0 1 Dimensions Unit(1) mm max nom min 2 mm scale A 0.5 A1 b D E e e1 0.05 0.25 1.65 1.65 0.20 1.60 1.60 0.55 0.00 0.15 1.55 1.55 0.5 L L1 v 0.35 0.15 0.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm 1 2 SOT1116 b 4 3 (4×)(2) L L1 e 8 7 e1 6 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 max 0.35 0.04 0.20 1.25 1.05 nom 0.15 1.20 1.00 0.55 min 0.12 1.15 0.95 0.3 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm SOT1203 b 2 1 3 (4×)(2) 4 L L1 e 8 7 6 e1 e1 5 e1 (8×)(2) A1 A D E terminal 1 index area 0 0.5 scale Dimensions Unit mm 1 mm A(1) A1 b D E e e1 L L1 max 0.35 0.04 0.20 1.40 1.05 0.35 0.40 nom 0.15 1.35 1.00 0.55 0.35 0.30 0.35 min 0.12 1.30 0.95 0.27 0.32 Note 1. Including plating thickness. 2.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC2G241 v.13 20130408 Product data sheet - 74LVC2G241 v.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
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74LVC2G241 NXP Semiconductors Dual buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . .