Datasheet

74LVC2G32_6 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 06 — 27 February 2008 9 of 15
NXP Semiconductors
74LVC2G32
Dual 2-input OR gate
13. Package outline
Fig 9. Package outline SOT505-2 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(1)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.70
0.35
8°
0°
0.13 0.10.20.5
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.47
0.33
SOT505-2 - - -
02-01-16
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
2
A
1
L
p
(A
3
)
detail X
A
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
1.1
pin 1 index