Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsDiodesSchottky Diode

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic

packages.

BAS40 series;

1PSxxSB4x series

General-purpose Schottky diodes

Rev. 08 — 13 January 2010 Product data sheet

Table 1. Product overview

Type number Package Configuration

NXP JEITA

1PS70SB40 SOT323 SC-70 single diode

1PS76SB40 SOD323 SC-76 single diode

1PS79SB40 SOD523 SC-79 single diode

BAS40 SOT23 - single diode

BAS40H SOD123F - single diode

BAS40L SOD882 - single diode

BAS40W SOT323 SC-70 single diode

1PS70SB44 SOT323 SC-70 dual series

BAS40-04 SOT23 - dual series

BAS40-04W SOT323 SC-70 dual series

1PS70SB45 SOT323 SC-70 dual common cathode

1PS75SB45 SOT416 SC-75 dual common cathode

BAS40-05 SOT23 - dual common cathode

BAS40-05W SOT323 SC-70 dual common cathode

1PS70SB46 SOT323 SC-70 dual common anode

BAS40-06 SOT23 - dual common anode

BAS40-06W SOT323 SC-70 dual common anode

BAS40-07 SOT143B - dual isolated

BAS40-07V SOT666 - dual isolated

BAS40-05V SOT666 - quadruple common cathode/

common cathode

1PS88SB48 SOT363 SC-88 quadruple common cathode/

common cathode

BAS40XY SOT363 SC-88 quadruple; 2 series

Summary of content (21 pages)

PAGE 1
BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 08 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 1.2 Features High switching speed High breakdown voltage Low leakage current Low capacitance 1.3 Applications Ultra high-speed switching Voltage clamping 1.4 Quick reference data Table 2.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes Table 3.
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NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Table 3.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 3. Ordering information Table 4.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 4. Marking Table 5.
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NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 6. Thermal characteristics Table 7.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes mlc361 102 mlc362 103 IR (μA) IF (mA) (1) 102 10 10 (1) (2) (3) (4) (2) 1 1 10−1 10−1 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 1 10−2 0 10 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C 20 30 VR (V) 40 (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 8. Package outline 1.35 1.15 0.45 0.15 1 2.7 2.3 0.85 0.75 1.1 0.8 1 1.65 1.25 1.55 1.15 1.8 1.6 2 2 0.40 0.25 0.25 0.10 0.34 0.26 Dimensions in mm Fig 5. 0.65 0.58 03-12-17 Package outline SOD323 (SC-76) 3.0 2.8 0.17 0.11 Dimensions in mm Fig 6. 02-12-13 Package outline SOD523 (SC-79) 1.7 1.5 1.1 0.9 1.2 1.0 1 3 0.55 0.35 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 1 2 0.48 0.38 1.9 2 0.15 0.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 3.0 2.8 2.2 1.8 1.1 0.9 1.9 6 4 2.5 2.1 1.1 0.8 5 4 2 3 0.45 0.15 3 0.45 0.15 1.4 1.2 1 2.2 1.35 2.0 1.15 pin 1 index 2 0.88 0.78 1 0.48 0.38 0.15 0.09 0.25 0.10 0.3 0.2 0.65 1.3 1.7 Dimensions in mm 04-11-16 Fig 11. Package outline SOT143B Dimensions in mm 06-03-16 Fig 12. Package outline SOT363 (SC-88) 1.7 1.5 0.95 0.60 1.8 1.4 3 6 0.45 0.15 0.6 0.5 5 4 0.3 0.1 1.75 0.9 1.45 0.7 1.7 1.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) 2.15 0.50 0.60 1.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 19.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist R = 0.05 (8×) 0.30 (2×) 0.40 (2×) 0.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 0.50 (3×) 1.90 3 solder resist occupied area 1 Dimensions in mm 0.55 (3×) 2.40 msa429 Fig 22. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 2.10 3 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Fig 23.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) solder resist 4 3 2.70 occupied area 1.30 3.00 1 2 solder paste msa441 0.90 1.00 2.50 Dimensions in mm Fig 24. Reflow soldering footprint SOT143B 4.45 1.20 (3×) 4 3 1.15 4.00 4.60 solder lands 1 solder resist 2 occupied area Dimensions in mm 1.00 3.40 preferred transport direction during soldering msa422 Fig 25.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) occupied area 0.6 (4×) Dimensions in mm 1.8 sot363_fr Fig 26. Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 1.3 preferred transport direction during soldering 2.45 5.3 sot363_fw Fig 27.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.2 0.6 1.1 0.7 2 2.0 3 0.85 1.5 1 0.6 (3x) 1.9 0.5 (3x) msa438 solder lands solder resist Dimensions in mm solder paste occupied area Fig 28. Reflow soldering footprint SOT416 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.538 2 1.7 1.075 0.3 (2×) 0.55 (2×) placement area solder paste occupied area 0.325 0.375 (4×) (4×) Dimensions in mm 1.7 0.45 (4×) 0.6 (2×) 0.5 (4×) 0.
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BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 11. Revision history Table 10. Revision history Document ID Release date BAS40_1PSXXSB4X_SER_8 20100113 Modifications: Data sheet status Change notice Supersedes Product data sheet - BAS40_1PSXXSB4X_SER_7 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content.
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NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . .