Datasheet

BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 18 of 21
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
Fig 28. Reflow soldering footprint SOT416
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
solder resist
occupied area
solder lands
solder pasteDimensions in mm
msa438
2.0
0.6
(3x)
0.7
1.5
1
2
3
1.1
2.2
0.5
(3x)
0.85
0.6
1.9
solder lands
placement area
occupied area
solder paste
sot666_
fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.075
0.538
Dimensions in mm