DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage MBD128 BC846S NPN general purpose double transistor Product data sheet Supersedes data of 1999 May 28 1999 Sep 01
NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S FEATURES • Two transistors in one package • Reduces number of components and board space handbook, halfpage • No mutual interference between the transistors. 6 6 5 5 4 4 TR2 APPLICATIONS TR1 • General purpose switching and small signal amplification. 1 2 3 1 Top view 2 3 MAM340 DESCRIPTION NPN double transistor in an SC-88 (SOT363) plastic six lead package. Fig.1 Simplified outline (SC-88) and symbol.
NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 416 K/W note 1 Note 1. Refer to SC-88 (SOT363) standard mounting conditions. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet NPN general purpose double transistor MGL738 103 handbook, halfpage BC846S MGL739 1200 handbook, halfpage VBE (mV) VCEsat (mV) 1000 (1) 800 (2) 102 (1) 600 (2) (3) (3) 400 10 10−1 1 102 10 IC (mA) 200 10−1 103 IC/IB = 20. (1) Tamb = 150 °C. (2) Tamb = 25 °C. (3) Tamb = −55 °C. VCE = 5 V. (1) Tamb = −55 °C. (2) Tamb = 25 °C. (3) Tamb = 150 °C. Fig.2 Fig.
NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 v M A 4 5 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.
NXP Semiconductors Product data sheet NPN general purpose double transistor BC846S DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
