DISCRETE SEMICONDUCTORS DATA SHEET M3D744 BC847BVN NPN/PNP general purpose transistor Product data sheet Supersedes data of 2001 Aug 30 2001 Nov 07
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor FEATURES BC847BVN PINNING • 300 mW total power dissipation PIN • Very small 1.6 mm x 1.2 mm ultra thin package 1, 4 emitter TR1; TR2 • Excellent coplanarity due to straight leads 2, 5 base TR1; TR2 • Replaces two SC-75/SC-89 packaged transistors on same PCB area 6, 3 collector TR1; TR2 DESCRIPTION • Reduced required PCB area • Reduced pick and place costs.
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor BC847BVN THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS thermal resistance from junction to ambient notes 1 and 2 VALUE UNIT 416 K/W Notes 1. Transistor mounted on an FR4 printed-circuit board. 2. The only recommended soldering is reflow soldering. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor BC847BVN MLD703 600 MLD704 1200 handbook, halfpage handbook, halfpage VBE mV 1000 (1) hFE (1) 400 800 (2) (2) 600 (3) 200 (3) 0 10−1 1 400 10 102 IC (mA) 200 10−2 103 10−1 TR1 (NPN); VCE = 5 V. (1) Tamb = 150 °C. (2) Tamb = 25 °C. (3) Tamb = −55 °C. TR1 (NPN); VCE = 5 V. (1) Tamb = −55 °C. (2) Tamb = 25 °C. (3) Tamb = 150 °C. Fig.2 Fig.3 DC current gain as a function of collector current: typical values.
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor BC847BVN MLD699 1000 MLD700 −1200 handbook, halfpage handbook, halfpage VBE hFE mV −1000 800 (1) 600 −800 (1) (2) −600 400 (2) 200 0 −10−2 (3) −400 (3) −10−1 −1 −10 −200 −10−2 −102 −103 IC (mA) −10−1 TR2 (PNP); VCE = −5 V. (1) Tamb = 150 °C. (2) Tamb = 25 °C. (3) Tamb = −55 °C. TR2 (PNP); VCE = −5 V. (1) Tamb = −55 °C. (2) Tamb = 25 °C. (3) Tamb = 150 °C. Fig.6 Fig.
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor BC847BVN PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT666 D E A X Y S S HE 6 5 4 pin 1 index A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.
NXP Semiconductors Product data sheet NPN/PNP general purpose transistor BC847BVN DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
