DISCRETE SEMICONDUCTORS DATA SHEET BC859; BC860 PNP general purpose transistors Product data sheet Supersedes data of 1999 May 28 2004 Jan 16
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 FEATURES PINNING • Low current (max. 100 mA) PIN • Low voltage (max. 45 V). APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • Low noise input stages of audio frequency equipment. DESCRIPTION PNP transistor in a SOT23 plastic package. NPN complements: BC849 and BC850.
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO PARAMETER collector-base voltage CONDITIONS MAX. UNIT open emitter − −30 V − −50 V BC859 − −30 V BC860 − −45 V BC859 BC860 VCEO MIN.
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER collector cut-off current CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 MBH727 400 handbook, full pagewidth hFE VCE = −5 V 300 200 100 0 −10−2 −10−1 −1 −10 −102 IC (mA) −103 BC859B; BC860B. Fig.2 DC current gain; typical values. MBH728 600 handbook, full pagewidth hFE 500 VCE = −5 V 400 300 200 100 0 −10−2 −10−1 −1 −10 BC859C; BC860C. Fig.3 DC current gain; typical values.
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet PNP general purpose transistors BC859; BC860 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
