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1. Product profile

1.1 General description

NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

[1] Valid for all available selection groups.

1.2 Features and benefits

 High current

 Two current gain selections

 High power dissipation capability

 Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)

 Leadless very small SMD plastic package with medium power capability (SOT1061)

 AEC-Q101 qualified

1.3 Applications

1.4 Quick reference data

BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

Rev. 8 — 18 October 2011 Product data sheet

Table 1. Product overview

Type number

[1]

Package PNP complement

NXP JEITA JEDEC

BCP68 SOT223 SC-73 - BCP69

BC868 SOT89 SC-62 TO-243 BC869

BC68PA SOT1061 - - BC69PA

 Linear voltage regulators  Power management

 Low-side switches  MOSFET drivers

 Battery-driven devices  Amplifiers

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

CEO

collector-emitter voltage open base - - 20 V

collector current - - 2 A

peak collector current single pulse; t

 1ms - - 3 A

Summary of content (23 pages)

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BCP68; BC868; BC68PA 20 V, 2 A NPN medium power transistors Rev. 8 — 18 October 2011 Product data sheet 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP JEITA JEDEC BCP68 SOT223 SC-73 - BCP69 BC868 SOT89 SC-62 TO-243 BC869 BC68PA SOT1061 - - BC69PA [1] PNP complement Valid for all available selection groups. 1.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors Table 2. Quick reference data …continued Symbol Parameter hFE Conditions DC current gain hFE selection -25 [1] Min Typ Max VCE = 1 V; IC = 500 mA [1] 85 - 375 VCE = 1 V; IC = 500 mA [1] 160 - 375 Unit Pulse test: tp  300 s;  = 0.02. 2. Pinning information Table 3.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 3. Ordering information Table 4. Ordering information Type number[1] Package Name Description Version BCP68 SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 BC868 SC-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 BC68PA HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2  2  0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 32 V VCEO collector-emitter voltage open base - 20 V VEBO emitter-base voltage open collector - 5 V IC collector current - 2 A ICM peak collector current - 3 A IB base current - 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac674 1.5 006aac675 1.5 (1) (1) Ptot (W) Ptot (W) (2) 1.0 (2) 1.0 (3) (3) 0.5 0.5 0.0 –75 –25 25 75 0.0 –75 125 175 Tamb (°C) –25 25 75 125 175 Tamb (°C) (1) FR4 PCB, mounting pad for collector 6 cm2 (1) FR4 PCB, mounting pad for collector 6 cm2 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, mounting pad for collector 1 (3) FR4 PCB, standard footprint Fig 1.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 6. Thermal characteristics Table 7.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac677 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 006aac678 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 1 0 10–1 10–5 0.02 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac679 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 1 0 10–1 10–5 0.02 0.01 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 6 cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 006aac680 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 0.33 0.2 102 0.1 0.05 10 0.02 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac681 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 0.33 0.2 102 0.1 10 0.05 0.02 0.01 1 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 1 cm2 Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 006aac682 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 10 0.05 1 0 10–1 10–5 0.02 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac683 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 0.33 0.25 0.2 102 0.1 0.05 10 0.02 1 0.01 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac684 103 Zth(j-a) (K/W) 102 10 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac685 103 Zth(j-a) (K/W) duty cycle = 1 0.75 0.5 0.33 0.25 0.2 102 0.1 10 1 0 10–1 10–5 0.05 0.02 0.01 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2 Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac686 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.25 0.33 0.2 0.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac687 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.25 10 0.1 1 0 10–1 10–5 0.33 0.2 0.05 0.02 0.01 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2 Fig 14.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac694 400 006aac710 2.4 (1) hFE IB (mA) = 10 IC (A) 9 300 8 (2) 1.6 7 6 200 5 (3) 4 0.8 3 100 2 1 0 10–4 10–3 10–2 10–1 0.0 1 10 0 1 2 3 IC (A) 4 5 VCE (V) Tamb = 25 C VCE = 1 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 15. DC current gain as a function of collector current; typical values 006aac695 1.2 Fig 16.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 6.7 6.3 3.1 2.9 1.8 1.5 4 1.1 0.7 7.3 6.7 3.7 3.3 1 2 3 0.32 0.22 0.8 0.6 2.3 4.6 Dimensions in mm 04-11-10 Fig 19.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 1.3 0.65 max 0.35 0.25 1 1.05 0.95 2 0.45 0.35 1.1 0.9 0.3 0.2 2.1 1.9 3 1.6 1.4 Dimensions in mm 2.1 1.9 09-11-12 Fig 21. Package outline SOT1061 (HUSON3) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 11. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4×) (4×) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 sot223_fr Fig 22. Reflow soldering footprint SOT223 (SC-73) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 8.7 occupied area Dimensions in mm 1 2 3 1.9 (3×) 2.7 preferred transport direction during soldering 2.7 1.1 1.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 4.75 2.25 2 1.9 1.2 0.2 0.85 solder lands 1.7 1.2 4.6 solder resist 0.5 4.85 solder paste occupied area 1.1 (2×) 1 (3×) 1.5 Dimensions in mm 1.5 0.6 (3×) 0.7 (3×) 3.95 sot089_fr Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) 6.6 2.4 3.5 solder lands 7.6 0.5 solder resist occupied area 1.8 (2×) Dimensions in mm preferred transport direction during soldering 1.9 1.5 (2×) 1.9 0.7 5.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 2.1 1.3 0.5 (2×) 0.4 (2×) 0.5 (2×) 0.6 (2×) 1.05 2.3 0.6 0.55 0.25 1.1 0.25 1.2 0.25 0.4 0.5 1.6 1.7 Dimensions in mm solder paste = solder lands solder resist occupied area sot1061_fr Reflow soldering is the only recommended soldering method. Fig 26. Reflow soldering footprint SOT1061 (HUSON3) BCP68_BC868_BC68PA Product data sheet All information provided in this document is subject to legal disclaimers.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BCP68_BC868_BC68PA v.8 20111018 Product data sheet - BC868 v.7 BCP68 v.4 Modifications: • The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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BCP68; BC868; BC68PA NXP Semiconductors 20 V, 2 A NPN medium power transistors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.
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NXP Semiconductors BCP68; BC868; BC68PA 20 V, 2 A NPN medium power transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . .