DISCRETE SEMICONDUCTORS DATA SHEET BCV26; BCV46 PNP Darlington transistors Product data sheet Supersedes data of 1999 Apr 08 2004 Jan 13
NXP Semiconductors Product data sheet PNP Darlington transistors BCV26; BCV46 FEATURES PINNING • High current (max. 500 mA) PIN DESCRIPTION • Low voltage (max. 60 V) 1 base • Very high DC current gain (min. 10 000). 2 emitter 3 collector APPLICATIONS • Where very high amplification is required. DESCRIPTION handbook, halfpage PNP Darlington transistor in a SOT23 plastic package. NPN complements: BCV27 and BCV47.
NXP Semiconductors Product data sheet PNP Darlington transistors BCV26; BCV46 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO PARAMETER collector-base voltage CONDITIONS MAX. UNIT open emitter − −40 V − −80 V BCV26 − −30 V BCV46 − −60 V BCV26 BCV46 VCES MIN.
NXP Semiconductors Product data sheet PNP Darlington transistors BCV26; BCV46 CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER CONDITIONS MIN. TYP. MAX.
NXP Semiconductors Product data sheet PNP Darlington transistors BCV26; BCV46 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet PNP Darlington transistors BCV26; BCV46 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
