DISCRETE SEMICONDUCTORS DATA SHEET BCV27; BCV47 NPN Darlington transistors Product data sheet Supersedes data of 1999 Apr 08 2004 Jan 13
NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 FEATURES PINNING • Medium current (max. 500 mA) PIN DESCRIPTION • Low voltage (max. 60 V) 1 base • High DC current gain (min. 20 000). 2 emitter 3 collector APPLICATIONS • Preamplifier input applications. DESCRIPTION handbook, halfpage NPN Darlington transistor in a SOT23 plastic package. PNP complements: BCV26 and BCV46.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO PARAMETER collector-base voltage CONDITIONS MAX. UNIT open emitter − 40 V − 80 V BCV27 − 30 V BCV47 − 60 V BCV27 BCV47 VCES MIN.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER CONDITIONS MIN. TYP. MAX. UNIT collector cut-off current BCV27 IE = 0; VCBO = 30 V − − 100 nA BCV47 IE = 0; VCBO = 60 V − − 100 nA − − 100 nA IC = 1 mA 4 000 − − IC = 10 mA 1 0 000 − − IC = 100 mA 2 0 000 − − IEBO emitter cut-off current IE = 0; VEB = 10 V hFE DC current gain VCE = 5 V; (see Fig.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
